Zestron Webinar: Designing for Reliability in Class III Assemblies
October 26, 11 AM EST
When designing high-reliability electronic assemblies, functionality is critical and long-term reliability is essential. Join our webinar for a detailed overview of the various failure mechanisms including the challenges associated with improper cleaning, board complexity, material mix, component, and the package types used. Thru an in-depth case study examination, we will discuss the steps involved in reducing the risk of failures while improving long-term reliability.