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iNEMI Newsletter Included IPC APEX Activities


Interactive iNEMI Roadmap Sessions Scheduled at IPC APEX EXPO

Dedicated teams are working to create new content for the iNEMI Roadmap, and we are looking for input from many contributors. Join us at IPC APEX EXPO on January 24 for two open brainstorming sessions on topics related to PCB and board assembly with iNEMI Director of Roadmapping Francis Mullany, joined by iNEMI Board Member Ranjan Chatterjee (Cimetrix), who is Co-chair of the Smart Manufacturing topic, and Tarja Rapala (EIPC), Co-chair of the PCB topic.

Roadmapping Smart Manufacturing for PCB Manufacturing and Board Assembly
Smart manufacturing has been long positioned as a key transformation for electronics manufacturing; however, the rate of adoption has been variable across the electronics supply chain. This interactive workshop session will explore the challenges in the deployment of smart manufacturing in PCB manufacturing and board assembly. It is scheduled for Tuesday, January 24, 8:00-9:30 a.m., location 10. For additional information

Roadmapping Future Application Drivers and Requirements for PCBs
This session will explore the technical drivers and requirements for PCBs and how they will evolve over time, segmented by application class: consumer, high-performance computing, flexible electronics and harsh environments. It is scheduled for Tuesday, January 24, 10:00-11:30 a.m., location 10. For additional information 

Meet iNEMI Staff at IPC APEX EXPO

iNEMI CEO Shekar Chandrashekhar (shekhar.chandrashekhar@inemi.org), along with Grace O’Malley, Vice President of Technical and Project Operations (gomalley@inemi.org) and Director of Roadmapping Francis Mullany (fmullany@inemi.org) will be attending APEX this year. Please email them if you are attending the conference and would like to meet. 

5G/6G MAESTRO Workshop Scheduled 

iNEMI, along with several partners, is developing the 5G/6G mmWave Materials and Electrical Test Technology (5G/6G MAESTRO) as part of the NIST Advanced Manufacturing Technology (MfgTech) Roadmap. The goal of this roadmap is to create a foundation of knowledge and expertise in the U.S. to support the development and manufacturing of leading edge 5G and 6G products. Join us February 9 for an introduction to the roadmap creation and a status update, including highlights of the progress to date with reports from:

  • Georgia Institute of TechnologyIdentification of Next Generation Materials and Testing Needs — a status report on dielectric properties together with suggestions about where work is needed to move into the 5G and 6G bands.
  • Florida International University: mmWave System Design Analysis/Trends and Recommendations — key advances in system architectures and package integration that will enable future mmWave systems.

Get additional information.


Nominations Are Open for iNEMI Board of Directors 

Nominations are now being accepted for the iNEMI Board of Directors. Our Board comprises 8 to 13 individuals from Participating Member companies who serve staggered three-year terms. This year, four directors are up for re-election. There are an additional two seats that are optional to fill based on Board agenda and strategy as applicable.  Please note that there can only be one nomination per Participating Member. Nominations close February 6 and voting will take place during March. Watch your email for detailed instructions about candidate nominations.

iNEMI Roadmap: A Status Check
 
For the iNEMI Roadmap, 2022 saw the build-out of the infrastructure, both technical and organizational, needed for the new roadmap format.  Teams are now coming together to create new content for priority topics and 2023 will see these gradually published online:

  • 5G/6G mmWave Materials: The final review of 5G/6G materials characterization is in process and will be published in January.   
  • Smart Manufacturing: Updated content is being created at a brisk pace by a small team. A draft will be available for review to a wider group in the first quarter.
  • Board Assembly: Initial kick-off meeting held.
  • PCB: Initial kick-off meeting held.
  • Sustainable Electronics: Initial kick-off meeting scheduled.
  • Packaging and Heterogenous Integration: Topic co-chairs identified and now actively recruiting contributors.

Other topics that we are kick-starting in 1Q23 include Supply Chain Resiliency, Flexible Hybrid Electronics and an application-focused task force.  If you are interested in any of the above topics, please fill out the expression-of-interest form or contact Francis Mullany (fmullany@inemi.org), iNEMI’s Director of Roadmapping.

Submit Your Nominations for iNEMI’s 2023 Awards & Recognition Program

iNEMI members — submit your nominations for the 2023 Awards & Recognition Program, which recognizes accomplishments by iNEMI project teams as well as individuals from our member organizations. Any individual working for an iNEMI member organization can nominate in three different categories: (1) Project Leadership Award, which recognizes the team members of iNEMI projects that have a positive impact on the electronics manufacturing value chain; (2) Dedicated Service Award, which is given to an individual who has demonstrated exceptional performance, leadership and dedication to iNEMI; and (3) iNEMI Fellow for individuals who have demonstrated outstanding engineering achievements, both within and outside iNEMI. Get additional details about each award and the nomination process.

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