Key Summary Policymakers, industry leaders, and technical experts convened in Brussels for a summit hosted by the Global Electronics Association, concluding that Europe’s competitiveness requires a
Advanced semiconductor packaging has become a central technology platform for high performance computing. For AI and HPC processors, performance depends not only on transistor density,
LONDON: The latest research from Omdia shows that US PC shipments (excluding tablets) fell 7.0% year-over-year in Q1 2026 to 15.8 million units, the largest
Minneapolis, MN – The SMTA is proud to announce the Next Gen 10 award recipients for 2026. SMTA’s Next Gen 10 program recognizes young leaders who are
Key Summary: Europe’s electronics circularity goals are advancing, but scaling them remains a challenge. Key barriers include limited material recovery, infrastructure gaps, and insufficient funding.
