iNEMI Packaging Tech Topic Series: Fan-Out Wafer and Panel-Level Packaging

Packaging Tech Topic Series

Status and Trends in Fan-Out Wafer
and Panel-Level Packaging

Dr. Tanja Braun, Fraunhofer IZM
October 27, 2021

Fan-out wafer and panel-level packaging (FOWLP/PLP) are gaining relevance as advanced packaging technologies. Providing technical advantages and optimized cost for a variety of applications, FOWLP and PLP are fundamentally changing the packaging infrastructure. Although OSATs previously dominated high-volume manufacturing, new players such as semiconductor foundries and PCB or LCD manufacturing companies are entering this business area, changing supply chains and creating larger form factors.

In this webinar, Dr. Tanja Braun (Fraunhofer IZM) will highlight recent technical developments and the changing ecosystem associated with the trend toward FOWLP and PLP. For additional information.

The webinar is open to industry; advance registration is required. For additional information, please contact Masahiro Tsuriya (

Wednesday, October 27, 2021
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Open to members and non-members
Register for this webinar

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