Indium Corporation Expert to Present at ICEP
The factors that are driving the wider electronics industry towards lower process temperatures are also having an impact on the first level interconnects that are the interface between the increasingly complex processors and the circuitry that relies on those processors for delivering the functionality on which modern society is now so dependent. In Low-Temperature First Level Interconnect in Packaging and its Challenges, Lim examines materials and processes currently used for first level interconnects and possible options for achieving significant reductions in temperatures to which the processor is exposed during packaging.
Lim is the Global Product Manager for Semiconductor and Advanced Materials and is based in Malaysia. She manages the semiconductor product lines globally and works closely with the internal sales and R&D teams to develop solutions for industry needs and requirements. She also collaborates with external customers and corporate partners to support the industry’s move towards heterogeneous integration. Some of her recent work includes the development of materials and processes for advanced packaging for fine feature printing for SiP applications as well as for one-step OSP ball-attach applications. Lim has more than 25 years of experience, specifically in the areas of PCB assembly and surface mount technology. She joined Indium Corporation in 2007 as a technical manager in Southeast Asia. Prior to that, she was a research and development chemist, focusing on solder paste and flux formulation. Lim also worked as a technical manager at Inventec for nine years, where she provided technical support and managed testing in the lab. Lim earned her bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus in polymers. She is a Certified SMT Process Engineer, has earned her Six Sigma Green Belt designation, and is heavily involved in many research and road mapping organizations.