Indium Corporation Earns CIRCUITS ASSEMBLY New Product Introduction Award at IPC APEX Expo

Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-temperature alloy technology, Durafuse™ LT at the IPC APEX Expo technical conference on February 4 in San Diego, Calif., USA.                           

The NPI Awards recognize the leading new products for electronics assembly during the past 12 months. Honorees are selected by an independent panel of practicing engineers.

“We developed Durafuse™ LT as a solution to the challenges of conventional low-temperature solders. Having the electronics assembly industry recognize it as a leading new product is truly an honor,” said Chris Nash, Product Manager for PCB Assembly Solder Paste. “I am very proud of our team and the work they have done and continue to do to develop and deliver this and other high-reliability products to our customers.”

Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse™ LT provides improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. Durafuse™ LT:

  • Provides a solution for heat-sensitive components and flex polymers
  • Prevents thermal warpage of processor components and multilayer boards
  • Meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications

Learn more about Indium Corporation’s innovative low-temperature technology at booth 1037 at APEX, or online at

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

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