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Indium Corporation Announces New Versatile Solder Paste

Indium Corporation introduces Indium12.8HF as it continues to develop innovative solder paste solutions to meet customers’ current and emerging needs. Indium12.8HF is a versatile paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.

 

Indium12.8HF is a no-clean, halogen-free solder paste that is inherently compatible with Indium Corporation’s best-selling solder paste—Indium8.9HF—and is optimized for long-term jetting and microdispense applications. Originally formulated for micro-LED applications, Indium12.8HF has proven to be useful in a wide range of applications requiring precision dot diameter/line width deposits down to 80μm.

 

Additionally, Indium12.8HF:

  • Meets IPC J-STD-004B with Amendment 1 ROL0 requirements
  • Offers exceptional electrical reliability
  • Minimizes graping and similar reflow issues with a unique flux oxidation barrier formulation
  • Delivers aesthetically pleasing clear residue with minimal flow-out
  • Provides minimal reflow spatter compared to similar solder pastes
  • Long working (syringe) life

 

To learn more about Indium Corporation’s new jetting and microdispensing paste, visit www.indium.com/jetting-paste.

 

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