Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

DELAWARE, OH ― January 2018 ― Engineered Material Systems, a leading global supplier of adhesives, encapsulants, and conductive materials, is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.

506-03A/B is a two component, black, 100 percent solids, epoxy encapsulating compound characterized by its low mixed viscosity, quick gel (~8 minutes) and its excellent resistance to thermal shock, very good electrical properties and adhesion to a variety of substrates upon cure.

506-03A/B is the latest addition to Engineered Material Systems’ extensive line of potting/encapsulating materials that can be used in a multitude of applications to pot/encapsulate electrical and electronic assemblies.

For more information about the 506-03A/B or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit

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