SAN DIEGO – Altium LLC, a leading PCB design and realization software company, believes that students should have access to professional tools today to prepare them for
San Jose, California – USA – The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of the Test & System Package (TSP)
Former Flex President Caroline Dowling, former Google and Amazon VP of Supply Chain Mark Randall and former Dyson CEO and COO Jim Rowan join Advisory
IPC, Helping You Assess and Manage COVID-19 Risks at Your Workplace By David Krause, Senior Toxicologist at Healthcare Consulting & Contracting (HC3), and Kelly Scanlon, IPC
Manassas, VA – ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased
