Indium Corporation’s Jonathan Minter, Research and Development Metallurgy Technician, will present at the TMS 2018 Annual Meeting & Exhibition on March 11-15 in Phoenix, Ariz. High-Pb solders
Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, was recognized with two Distinguished Committee Service Awards from IPC at the IPC APEX Expo
Chandler, Arizona – Rogers Corporation (NYSE:ROG) is pleased to announce a development partnership with XOnano Smartfoam, the provider of self-sensing foam materials and wireless measurement technologies,
Visitors to this year’s IPC APEX EXPO will have a great opportunity to learn about implementing a new generation of two part conformal coatings into
Somerset, NJ – February, 2018 – Alpha Assembly Solutions, a provider of electronic soldering and bonding materials, will present its void reducing preform solutions at
