Atlanta–ECIA Chief Analyst Dale Ford sat down with Bill Bradford for a fascinating discussion of the state of the industry as 2019 winds down in
MILPITAS, Calif. — Marking the fourth consecutive quarterly decline, worldwide silicon wafer area shipments totaled 2,932 million square inches in the third quarter of 2019,
First Level Interconnect Void Characterization Project Two sessions scheduled December 12, 2019 Flip chip electronic packages are commonly used to address today’s high-density interconnect needs.
Dr. Ashutosh Tiwari is a technocrat, researcher and entrepreneur who has founded the International Association of Advanced Materials (IAAM), one of the largest networks for
Atlanta–The ECIA Board of Directors and Council leaders assigned the GIPC (Global Industry Practices Committee) to anticipate the unwinding/untangling of inventory issues inflicted through the
