Samsung VP to Keynote IWLPC
San Jose, California – USA – The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of the Test & System Package (TSP) unit at Samsung Electronics will deliver the opening keynote presentation of the virtual event. The presentation, “Trends, Challenges, Opportunities in Advanced Packaging for Smart Computing Era” will be released on Tuesday, […]
Omnics Announces Additions to Board of Advisors
Former Flex President Caroline Dowling, former Google and Amazon VP of Supply Chain Mark Randall and former Dyson CEO and COO Jim Rowan join Advisory Board of Digital Supply Chain Platform and Solutions company, Omnics. San Diego, CA – Omnics, a provider of digital supply chain planning and execution solutions, announced today that Caroline Dowling, […]
IPC Releases Guidance on Workplace Measures to Manage COVID-19 Risk
IPC, Helping You Assess and Manage COVID-19 Risks at Your Workplace By David Krause, Senior Toxicologist at Healthcare Consulting & Contracting (HC3), and Kelly Scanlon, IPC director of environment, health, and safety policy and research As the COVID-19 pandemic has persisted, we’ve learned a lot of surprising things about the virus and the disease, as well […]
North American Relay Sales Down 12%; Bookings Dropped 21% in 2019 Versus 2018
Originally posted on TTI MarketEye blog By Michael Schwert Total reported sales for all relay types in North America for the fourth quarter of 2019 were 12 percent less than reported in the previous quarter and down 25 percent from the same quarter of 2018. Sales units for Q4 2019 totaled came in down […]
Tin Pest in Medieval Culture
In this Indium blog, Ron Lasky walks us through what ‘tin pest’ is and why a Medieval scholar contacted him for information. Fascinating.