ABI Research’s Teardown Service Analyzes HTC’s U12+ Edge Sense 2 Technology
HTC introduced the next wave of smartphone user-interface innovation with the debut of Edge Sense on its U11. The recently released HTC U12+ features the next-generation Edge Sense 2, which reportedly brings even more ways to interact with the phone — simply by squeezing its lower sides or edges. While the technology behind the squeeze […]
Memory ICs to Account for 53% of Total 2018 Semi Capex, IC Insights Says
Flash memory is forecast to represent the largest share of capital spending while DRAM capex grows at the highest rate this year. IC Insights forecasts total semiconductor capital expenditures will rise to $102.0 billion this year, marking the first time that the industry has spent more than $100 billion on capital expenditures in one year. […]
Innovative Testing of High Reliability PCB Manufacturers
PCB’s (printed circuit boards) were first used in the 1920s. They were fabricated from materials known as Bakelite, Masonite, layered cardboard and even thin wooden (cellulose) planks. Holes were drilled into the fabricated PCB material….Fast forward to today, and we are still trying to improve upon the printed circuit board to support government military, aerospace, and defense electronics high reliability needs
David Webb, Sales Manager, Semiconductor and Assembly Solutions, Seica at Semicon West 2018
Filmed on location by SCOOP