MacDermid Enthone Releases New Immersion Tin for QFNs
Waterbury, CT, USA – MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, announces the release of the PackagePrep CE Tin S process. This simplified tin plating process for singulated QFN package side walls provides consistent solder flank fillet formation for a more reliable solder joint under the increasingly demanding requirements of the automotive electronics […]
Avalue Centimeter- level Indoor Real-time Location Solution
TAIPEI, TAIWAN –Avalue Technology a global industrial PC solution provider and an associate member of the Intel® Internet of Things Solutions Alliance。Avalue indoor real-time location solution uses Ultra-Wideband (UWB) wireless communication technology, equipped with Avalue positioning system, which provides a complete solution for seamless sensing and precise indoor positioning for different vertical market applications. Industrial grade real-time indoor […]
Transition Automation Announces New Permalex® Blades for YAMAHA Printers
Tyngsboro, Massachusetts, USA—Transition Automation, Inc., today announces the availability of a newly-designed Permalex® blade system for YAMAHA SMT printers. The new design features a two-part assembly that enables users to purchase either the blade element or the blade and holder element separately. The company has also expanded the range of available sizes for this equipment […]
AISIN, ADVICS, JTEKT and DENSO Reach Basic Agreement to Establish Joint Venture to Develop Integrated ECU Software for Automated Driving
Kariya(Japan) – Aisin Seiki Co., Ltd (AISIN), ADVICS Co., Ltd. (ADVICS), JTEKT Corporation(JTEKT) and DENSO Corporation (DENSO) today announced that the four companies have reached a basic agreement to establish a joint venture company to develop integrated ECU software for automated driving and vehicle dynamics control. The company will be capitalized with the participation ratio of DENSO 65%, AISIN 25%, ADVICS 5% and JTEKT 5%. The automotive industry is in an era of profound transformation, […]
Indium Corporation to Feature InFORMS® Reinforced Solder Preforms at IMAPS 2018
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at IMAPS 2018, Oct. 8-11 in Pasadena, Calif. Indium Corporation is redefining solder with its InFORMS® solder preforms. InFORMS® are a composite preform consisting of solder with a reinforcing matrix. This results in: Improved mechanical and thermal reliability Uniform bondline thickness Low-voiding performance InFORMS® do more than just bond two surfaces. These solder […]