ZESTRON’s Ravi Parthasarathy will be Presenting at SMTA Capital Expo
Manassas, VA – ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Ravi Parthasarthy will be presenting, “Jet Printed Solder Paste and Cleaning Challenges” at the SMTA Capital Expo on August 22.
Recent evidence has shown that it is becoming extremely challenging to consistently deliver the correct amount of solder using the screen printing process. More and more manufacturers in today’s production environment are overcoming this challenge by incorporating jet printing as an additional step to increase solder paste volume. Solder paste jetting offers the flexibility to deposit the right volume of solder paste on boards with both miniature and large components that must be soldered adjacent to each other.
Anecdotal evidence indicates that as solder powder becomes finer, the resulting flux residues become more difficult to remove. This presentation is part of a study executed specifically on jet printing (Type 5) solder pastes using multiple cleaning agents in both spray-in-air inline and batch cleaning systems. The results are further validated by several industry case studies.
Along with Mr. Parthasarathy’s presentation, ZESTRON will have an exhibit at SMTA Capital event. Please visit us in the expo area to discuss cleaning solutions applicable to your electronics engineering or manufacturing process. For more information or to register for SMTA Capital please visit smta.org.
ZESTRON is headquartered in Manassas, Virginia and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information or to tour one of our technical centers, please visit www.zestron.com.