Kulicke & Soffa Research Collaboration with NUS Institute of Operations Research and Analytics Extends Smart Manufacturing Capabilities

SINGAPORE–Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced today it has engaged the Institute of Operations Research and Analytics (IORA), a research institute under the National University of Singapore (NUS) on a research collaboration intended to leverage artificial intelligence and deep learning to further enhance its global manufacturing and operational efficiencies into the long-term.

This research collaboration is one component to the Company’s broader factory automation roadmap over the next three years. The goal of this factory automation investment is to further improve the productivity, efficiency and quality of Kulicke & Soffa’s products and manufacturing capabilities.

This research collaboration will focus on applying deep machine learning to detect anomalies and to predict process outcomes that further optimize manufacturing processes and supplier management. The Company intends to drive productivity, extend quality and further enhance customer satisfaction with this ongoing factory automation roadmap.

Joyce Lim, Kulicke & Soffa’s Senior Vice President of Global Operations and Supply Chain, said, “We are delighted to collaborate with IORA. Smart data analytics are setting a new standard for production enhancements and logistics efficiency through multi-dimensional aspect modelling.”

This collaboration with K&S enables NUS researchers to apply our expertise in operations research and analytics in a real-world setting. It also offers a valuable and unique opportunity to make an impact to the Industry 4.0 revolution,” said Professor Teo Chung Piaw, Executive Director, IORA.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com)

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