iNEMI Releases Revised Event Calendar

iNEMI announces the following webinars and events

Wafer/Panel Level Package Flowability and Warpage End-of-Project Webinar Session 1 (APAC and Americas) – April 7/8
Wafer/Panel Level Package Flowability and Warpage End-of-Project Webinar Session 2 (APAC and EMEA) – April 16
iNEMI Roadmap Highlights & Gap Analysis Series: Organic PCB – April 22
iNEMI Roadmap Highlights and Gap Analysis Series – April 29
PCB Warpage Characterization and Minimization End-of-Project Webinar – May 13

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Jennifer Read

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