Indium Corporation to Feature Proven Products at SiP Conference China

Indium Corporation will feature products from its SiP portfolio at SiP Conference China, May 21, Shanghai, China.

From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications. Those products include:

  • SiPaste® ultrafine-pitch solder paste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 7. They help Avoid the Void®, reduce slumps, and demonstrate consistent superior printing performance. SiPaste® C201HF is specifically formulated to accommodate fine feature printing, combining superior non-wet open performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields. Additionally, SiPaste® 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules.
  • WS-446HF ball-attach and flip-chip flux is a robust, halogen-free, water-wash flux designed to provide one simple solution to complicated applications, especially those with a single cleaning step, for both ball grid array (BGA) ball-attach and flip-chip processes.
  • WS-823 ball-attach flux is a proven one-step BGA ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. Its unique formulation provides excellent solderability on a wide range of surfaces, uniform pin transfer over extended periods, and low-voiding.
  • WS-829 wafer-level ball-attach flux is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard BGA manufacturing process (especially for the smallest sphere applications < 0.25mm) as well as wafer-/panel-level packaging.

Indium Corporation also offers a wide array of proven no-clean fluxes designed for today’s industry challenges, such as electronics devices in applications from the Internet of Things (IoT) to mobile devices and next-generation applications.

For more information on Indium Corporation’s ultra-low residue fluxes, visit www.indium.com/fluxes or visit Indium Corporation’s booth at the show.

 

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

 

SiP Conference China

SiP Conference China is widely regarded as the most prominent SiP Conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise, and all aspects of the SiP design chain, including assembly and test from OSAT, EMS, OEMs, IDM, fabless semiconductor companies, and silicon foundries, as well as material and equipment suppliers.

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