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Indium Corporation Announces Thermal Management Webinar

Indium Corporation’s Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Materials Applications, will host a Webex webinar focused on the thermal management market in high-performance applications as part of Indium Corporation’s InSIDER Series on April 28 at 9 a.m. Eastern/2 p.m. British.

Thermal interface materials (TIMs) are typically thin films of material that transfer heat from one surface to a cooler one. The thermal engineer or thermal architect is faced with many choices when assessing which TIM will best conduct heat away from sensitive devices. Pure metal or metal-based TIMs may be overlooked, even though their inherently high bulk thermal conductivities and higher performance make them worthy of consideration.

Metal TIMs have been successfully used for decades in high-end applications, such as power amplifiers for military and aerospace, in single-die lidded packages for high-end server CPUs, and in consumer PC applications where even liquid metals have been used. The enormous increases in demand for reliable high-performance computing (HPC) and artificial intelligence/machine learning (AI/ML) applications—combined with both increased heat flux (W/cm2) and increased device sensitivity to temperature—have led to a major semiconductor packaging focus on low thermal resistance solutions. Metal TIMs are an increasingly prominent part of that mix.

In White Heat – Red Hot: The Thermal Management Market in High-Performance Computing and Artificial Intelligence/Machine Learning, Dr. Mackie will examine the specific ways that the HPC and AI/ML market segments are driving an enormous growth in demand for high performance and, increasingly, for metal-based TIMs, and will also explore how continuous innovation at Indium Corporation is allowing the company to meet that demand.

Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. To register for Dr. Mackie’s webinar, visit The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to avoid Indium Corporation’s spam filters. This is a first come, first served event.

Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, semiconductor fabrication, and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. Dr. Mackie is also responsible for the development of Indium Corporation’s Applied Technology Roadmap. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging TIMs requirements. He is an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology, and holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, U.K., and a Master of Science (MSc) in colloid and interface science from the University of Bristol, U.K. He is an alumnus of the UC Berkeley Product Management program.