Indium Corporation Expert to Present at SMTA New England Expo & Tech Forum

Indium Corporation’s Meagan Sloan, Technical Support Engineer, will present on the importance of testing to ensure long-term reliability of flux residues during the SMTA New England Expo & Tech Forum, October 8, in Boxboro, Massachusetts, USA.

Sloan’s presentation, The Basics of SIR and ECM, will discuss the importance of surface insulation resistance (SIR) and electrochemical migration (ECM) tests to the electronics industry as solder paste and electronics manufacturers seek to determine the long-term reliability of flux residues. Test preparation is critical; if prepared incorrectly, results will differ significantly from the solder paste manufacturer’s results. By sharing the differences between the tests, including their respective procedures and parameters, Sloan aims to help engineers ensure the accuracy of their results.

Meagan provides technical support, including guidance and recommendations, to customers related to process steps, equipment, techniques, and materials. In addition, she delivers technical training to staff and industry partners. She joined Indium Corporation in 2018 after receiving her master’s degree in chemical engineering from Syracuse University. She received her undergraduate degree in a dual program between LeMoyne College and Syracuse University, earning the American Institute of Chemists Student Medal Award, the ACS Division of Analytical Chemistry Undergraduate Award, and the ACS Division of Organic Chemistry Undergraduate Award. Meagan is a member of the American Chemical Society.

Additionally, Indium Corporation partner MicroCare will present Cleaning for Reliability in Electronics. Tom Tattersall, Executive Vice President and COO, will examine how cleaning can be an important tool for enhancing reliability in a production engineer’s toolbox.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.


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