How Mycronic’s Vision Technology Brings Faster Cycle Times and Higher Resolution to 3D AOI
With rapid electrification comes massive change. From electric vehicles to industrial robotics to power control systems, the world is witnessing the rollout of advanced electronics by the billions. Each more complex and more specialized than the last. And each requiring the highest levels of quality and reliability. How will manufacturers of electronics seize this growing opportunity? The latest vision technology from Mycronic points toward a faster, sharper, and smarter path forward.
Accelerating electronics inspection
Clearly, the pressure is on for electronics manufacturers to produce a wider variety of products at higher volumes than ever before. Often while managing a global component shortage that places extreme demands on flexibility and reduction of waste. At the end of the day, the manufacturers of today’s most vital electronics have little choice but to find new ways to improve inspection performance and cycle times without compromising on quality.
Mycronic’s latest contribution to this effort is aimed at the heart of one of their key limiting factors: the speed and accuracy of 3D AOI inspection.
Enhanced review with high resolution images
Speed and resolution with zero compromises
With the new Iris 3D AOI vision technology from Mycronic, it’s now possible to achieve the industry’s highest resolution 3D image capture at cycle times up to thirty percent faster than with previous inspection systems. “To be clear,” explains Alexia Vey, Product Manager at Mycronic, “this is a speed increase of thirty percent for the full inspection cycle, from image acquisition to processing. Considering the system also handles nearly twice as many pixels, this is quite a remarkable performance improvement.”