How is solderability influenced by the PCB surface finish? ICAPE Webinar Nov. 10


How is solderability influenced by the PCB surface finish?

Nov 10, 2022 – 10:30 am – 12:30 pm (Indianapolis time)

To appreciate how the surface finish of the PCB impacts the solder process, it is necessary to understand how the process of soldering occurs.


Some texts on soldering begin with a phrase such as, “To create a good solder joint, one must….”.  This statement is misleading.  The solderer (person or machine) does not create the solder joint.  They are part of a process which, if performed in the correct sequence with the correct ingredients, results in a good solder joint.


One of these ingredients is the surface finish, which is seldom discussed in soldering texts.


The webinar will bridge this gap by covering the basic metallurgy of the soldering process and then relate this to the different intermetallics that create the bond between the high-Tin solder and the different surface finishes that are available on a PCB.


The webinar will conclude by comparing various surface finishes to highlight the differences in shelf life before assembly, wetting time during assembly, and joint strength after assembly.


10:30 am – 12:00 pm: How solderability is influenced by the PCB surface finish presentation – Stan L Bentley

12:00 pm – 12:30 pm: Questions & Answers – Stan L Bentley & Ron Sandala

Stan Loren BENTLEY

Technical North America Director


Production Manager RapidProto / Engineering Manager ICAPE USA

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