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Gene Weiner to Chair Special Forum on UHDI and Substrate Manufacturing at PCB East June 5

Gene Weiner, President of Weiner International Associates and Raymond E. Pritchard IPC Hall of Fame Member, will chair a special forum on UHDI and substrate manufacturing at PCB East 2024 on June 5 in Boxborough, Massachusetts.

The UHDI & Substrates: Design to Package Forum will cover the status of standards, a new build-up process, materials and equipment capable of producing lines and spaces down to 6 μm and beyond.

The forum is a complete, down-to-earth A-to-Z presentation for those needing information on how to approach what has become an approximately 20% – and growing – part of the PCB fabrication industry for advanced electronics packaging.

Nine noted industry members will present papers, which will enable designers and engineers to view new materials, processes, and equipment for fabricating UHDI circuitry and discuss how they affect the DFM process. Among them:

· The chief technical officer of one of North America’s leading PCB companies will discuss how his company is preparing for UHDI.

· The vice president of a European equipment company will show advances in equipment integration that enable higher yields in UHDI fabrication.

· The CEO of one of America’s first successful producers of UHDI circuitry will join a noted globally known digital design manager and one of the industry’s leading experts on

inspection and repair of Cu circuitry down to 2 μm in an open panel discussion.

The price is only $295! It includes free entry to PCB East’s one day exhibit and lunch. Register now at https://pcbeast.com/uhdi-forum/ as space is limited. For further information contact gene@weiner-intl.com or click the link: https://pcbeast.com/uhdi-forum/

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