Indium Corporation earned Electronics Manufacturing (EM) Asia’s Innovation Award for its Indium10.1HF Solder Paste. The award was presented in Shanghai, China, during NEPCON China. The
Somerset, NJ – Alpha Assembly Solutions, a supplier of electronic soldering and bonding materials, was the recipient of four (4) awards at NEPCON CHINA, recognizing
Indium Corporation will introduce its new Indium Oxide High BET powder designed to support emerging applications of the display industry at SVC TechCon from May
Indium Corporation’s Mary Ma, Research Chemist, was presented with the “Best Paper” award at the SMTA China East Technology Conference 2018 on April 23-26 in Shanghai, China.
Somerset, NJ – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently reached a milestone of being
