Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste series to help customers Avoid the Void® at SMTconnect, May 7-9, in Nuremberg, Germany.The Indium8.9HF series is a proven product that delivers
Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the EPP InnovationsForum Germany conference on March 13 in Böblingen, Germany. Karch’s presentation, Future-Proof Flux Systems
Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications. Indium Corporation’s InFORMS®
Eric Miscoll, EMSNOW Publisher, joins Dr. Mark Currie, Business Development Director, Solder Materials, Henkel to discuss the inflection point in the adoption of jetting of
Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at the 2018 Global Minor Metals Forum on Nov. 28 in Kunming, Yunnan, China. Vareha-Walsh’s
