Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise during the 21st International Conference on Electronic Packaging Technology (ICEPT), Aug. 12-15 in
The 4th Annual M-EXPO Wire Processing Technology event, produced by WHMA/IPC, has been postponed due to COVID-19 and the uncertainty of the situation in the
Indium Corporation’s Claire Hotvedt, Product Development Specialist, will host two InSIDER Series webinars focused on the company’s innovative low-temperature solder offering on May 12 at 2 p.m.
Due to the increasing spread of Covid-19 in Europe and the associated ban on all major German events up to and including the end of
Thursday, April 30 | 1:00 PM Eastern Atlanta – ECIA will host a webinar April 30 featuring Lectrix CEO Graham Kilshaw, focused on brand management during an
