ORLANDO, FL (January 5, 2026) – The IEEE Electronic Components and Technology Conference (ECTC), has extended the deadline for the Student Innovation Challenge for ECTC 2026.
Minneapolis, MN – The SMTA is excited to announce the technical program for the 2026 Wafer-Level Packaging Symposium. The symposium will be held February 17-19, 2026
ORLANDO, FL– The premier technical conference and product exhibition for the world’s semiconductor packaging industry, the IEEE Electronic Components and Technology Conference (ECTC), has announced
The SACHSEN! joint stand at SEMICON Japan in Tokyo from 17 to 19 December will be the meeting point for innovative technologies and Saxony’s top
SMTA Mexico announces its 2026 Regional Expos & Tech Forums, a nationwide series of technical expos for the electronics manufacturing industry: SMTA Monterrey –
