First state-of-the-art chip fab will break ground this year The government of India has approved a major investment in semiconductor and electronics production that will include the
New this year, student scholarship awarded by IPC Education Foundation BANNOCKBURN, Ill. — The best technical conference papers of the ECWC16 Technical Conference at
By [email protected] The European Commission published on 27 February its Communication on advanced materials. The Communication sets out the proposed approach to develop industrial leadership from Research
The Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for
SOURCE: Tom’s Hardware As part of IEEE Spectrum’s coverage of security advances made at their International Solid-State Circuits Conference (ISSCC) held last week, a team from the University of
