Associations

electronica 2020 Will Be Virtual

Messe München will organize electronica 2020 digitally as electronica virtual. The current travel restrictions in Europe, which are becoming more stringent, have required a re-thinking of

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Samsung VP to Keynote IWLPC

 San Jose, California – USA – The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of the Test & System Package (TSP)

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