Call-for-Participation Webinar iNEMI: Moisture Induced Expansion Metrology for  Packaging Polymetric Materials Project

Join us for this information session about iNEMI’s new project on moisture induced expansion metrology for packaging polymetric materials.
Electronic packaging comprises polymeric materials (dielectric, solder resist, core, mold, epoxy, etc.) that absorb moisture from the environment during substrate fabrication, packaging assembly and test processing. In some cases, this absorbed moisture causes material hygroscopic swelling and induces hygro-stress, which can lead to component warpage, delamination or popcorn failure during reflow or reliability tests.
Knowledge of the moisture properties of polymeric materials (diffusivity, concentration, hygroscopic swelling) is critical for optimizing package material and design to minimize moisture-related failures. However, these properties are not widely available due to a lack of measurement methods and the limited temperature capability of current commercial techniques (20-120°C).
The Moisture Induced Expansion Metrology for Packaging Polymetric Materials project will provide an experiment-based assessment of metrology options for characterization of materials expansion measurement and identify methods that extend swelling strain measurement capabilities beyond current temperature limits.
This webinar is open to industry. Two sessions (with the same content) are scheduled; advance registration is required. Click on one of the links below to register. For additional information, contact Masahiro Tsuriya (
Session 1 (APAC/Americas)
Tuesday, January 18
10:00-11:00 a.m. JST (Japan)
8:00-9:00 p.m. EST (Americas) on Monday, January 17
Session 2 (Americas/Europe/APAC) 
Tuesday, January 18
8:00-9:00 a.m. EST (Americas)
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan)

About The Author