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Alpha To Feature New Low Temperature Technology and Reclaim Services at two April 2018 SMTA Expos

Somerset, NJ – March, 2018 – Alpha Assembly Solutions, a provider of electronic soldering and bonding materials, will be promoting its latest low-temperature technology and updated Reclaim Services materials at the 2018 SMTA Expos being held in Dallas, Texas on April 10 and in Liverpool, NY on April 24.

At the Expos, Alpha will highlight ALPHA® OM-550, its newest low temperature solder paste. Officially launched in Janaury 2018, this innovative paste is setting new industry standards for performance and reliability.

ALPHA® OM-550 was designed to improve drop shock and thermal cycling performance versus existing low temperature alloys. Among its many features, ALPHA® OM-550 reduces warpage up to 99%, increasing production yields and reducing energy consumption. “The performance of this paste continues to impress us.“, said Robert Wallace, Regional Marketing Manager for the Americas. “Customers are pleased with the efficiencies in both energy and cost in addition to the BGA mechanical reliability, especially when compared to other low temp alloys“.

In addition, Alpha will also feature the recently completed ALPHA® Recycling Services Brochure. The brochure outlines the simple processes for electronic assemblers to turn production waste into revenue. Capable of processing all varieties of waste materials, Alpha has the technological edge for maximizing the recycling of solder paste and related solder paste debris, including used jars, dispensers, and stencil cleaning paper. Alpha has the safest, most efficient, environmentally-compliant recycling solutions and takes pride that no materials are ever sent to a landfill.

For additional information about Alpha’s industry-leading products and services, please visit