SMTA is calling for abstracts for the 2026 Conference.
Technical Paper + Presentation
Deadline to Submit
April 30, 2026
Conference Technical Tracks
Advanced Packaging (APT)
- Advances in 1st level packaging and assembly
Additively Manufactured Electronics (AME)
- Advances in additive process – methods, recipes, materials, assembly, and reliability
Low Temperature Solder (LTS)
- Developments that can enable reflow soldering below 200°C
Manufacturing for Excellence (MFX)
- Current project work in manufacturing process areas
Reliability and Harsh Environments (RHE)
- Reliability testing materials and technologies for developers & users
Test and Inspection (INS)
- Ensuring product reliability short & long-term
Women’s Leadership Program (WLP)
- Promote diversity in engineering fields
Feature Sessions
- Panel discussions, Ultra High Density Interconnect
