EMSNOW gains visibility into precisely how ‘materials science is changing the world’ from Indium’s Kevin Brennan. Macro industry trends resulting in higher density boards with larger chip packages require new alloys and fluxes to address warpage and voiding issues. High performance chips generate more heat and that requires a different soldering process altogether. Add rising silver costs, and supply chain issues to the mix and this is where the Indium R&D team can come to the rescue.
The product development team at Indium, he explains, has responded to the challenges with Durafuse LT (low temperature) and HR (high reliability) solder alloys, along with Indium’s new 12.9 HF flux formulation provide solutions to manage challenges. Kevin artfully explains how they partner with customers and equipment suppliers to work out processes to build these critical electronics.
