Indium Corporation Expert to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE 2025 December 15
Indium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International Conference on Emerging Electronics (ICEE), December 13–16, in Bengaluru, India. Dr. Zhang’s presentation, A Review on a Bi-free In-containing Lower-Temperature Solder, will discuss how Durafuse® LT, a Bi-free, In-containing low-temperature solder paste, is a robust alternative to BiSn-based […]
So You Think It’s “Just A Cable”? Think Again, with WERAP Group CSO Markus Hoffmann
EMSNOW’s Eric Miscoll sat down on the Productronica 2025 floor with WERAP Group’s Chief Sales Officer Markus Hoffmann to unpack how this Swiss‑based EMS group is building a dedicated aerospace and defense hub by adding a Lake Constance specialist in cabling and box build—and why that matters for schedules, certifications, and mission success. From EN […]