Welcome to Agritech 5.0; your future may depend on it
It’s finally spring, and what better topic for your Friday reading pleasure than this blog posting from Neil Sharp about IoT — the Internet of Tomatoes, that is. Robotics and AI combine to improve yields and offset climate change. But there are challenges to the spread of these smart farming techniques.
ECIA Welcomes Brian K. Giudice to Global Industry Practices Committee (GIPC)
Brian’s broad and deep manufacturers’ rep experience strengthens the Committee ATLANTA – ECIA is pleased to announce that Brian K. Giudice, Vice President of Sales for Alliance Electronics Marketing Group, Millennium Alliance has joined the GIPC. Brian is originally from Louisville, Kentucky, where he earned an engineering degree from the University of Kentucky. He […]
SmartSplit: Cycle time halved for selective soldering in mixed production
SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, is one of the most innovative companies in the industry. One of these innovations is SmartSplit, an intelligent software that cuts the cycle time in half for selective soldering in mixed production. With the appropriate sensors in the […]
Ev Dynamics Electric Delivery Vehicles Begin Road Testing by One of the World’s Largest Food Service Companies
HONG KONG– Ev Dynamics (Holdings) Limited (HK: 0476), a leading developer and manufacturer of new energy vehicles (NEVs), announced that one of the largest food service companies in the world has begun road testing 10 of its 6-meter electric delivery trucks in Mexico City. The customer’s current delivery fleet supports one of the world’s broadest […]
Indium Corporation Expert to Present at iMAPS SiP Conference
Indium Corporation’s Strategic Advisor Dr. Dongkai Shangguan will share his technical insight and expertise on advanced packaging at the Advanced System in Package Technology Conference & Exhibition, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), on Tuesday, June 21 in Sonoma, Calif., U.S. As advanced packaging continues to drive towards heterogeneous integration, new […]