iNEMI Packaging Tech Topic Series: Fan-Out Wafer and Panel-Level Packaging

Packaging Tech Topic Series Status and Trends in Fan-Out Wafer and Panel-Level Packaging Dr. Tanja Braun, Fraunhofer IZM October 27, 2021 Fan-out wafer and panel-level packaging (FOWLP/PLP) are gaining relevance as advanced packaging technologies. Providing technical advantages and optimized cost for a variety of applications, FOWLP and PLP are fundamentally changing the packaging infrastructure. Although OSATs […]

Seica Announces Flying Probe Test Technology for productronica 2021

November, 16-19-, Munich, Germany – Booth A1-445  Seica – Strambino, Italy, October 2021  – As the world leader in Flying Probe Test technology, Seica is where customers look for leading-edge solutions. At productronica they will be able to see that, once again, the future of FLYING PROBE TEST has arrived at Seica’s booth A1-445 in […]

SMTA Juarez Chapter Hosts Webinar

  Free for Everyone! Co-Hosted with SMTA Juarez Chapter   Thursday, October 28 @ 3:00pm-4:00pm (US Mountain) Register now! Presenter: Manuel Munguia, Ingeniero de Soporte Técnico Senior de AIM Solder Overview Título: Pin In Paste – Una alternativa económica para la  soldadura por ola/selectiva/manual Subtemas: – Introducción – Consideraciones sobre el material – Pasos del proceso […]

CalcuQuote Integrates with Cetec to Improve Quoting

CalcuQuote and Cetec ERP announce integration to combine the power of Cetec ERP’s breadth of functionality with CalcuQuote’s supply chain connectivity. The integration will allow Printed Circuit Board Assembly (PCBA) and Cable/Wire Harness Assembly companies to experience seamless integration between quoting, part number management, purchasing and order status management.   Dallas, TX – High-mix, low-volume […]

Indian electronics manufacturing is in a boom period

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Electronics manufacturing in India is currently in a boom period, thanks to the Government-induced production-linked incentive (PLI) schemes. Here is an exclusive analysis by India technology blogger Pradeep Chakraborty that provides the details.