Key Tronic Corporation Announces Completion of Audit Committee Investigation
SPOKANE VALLEY, Wash.– Key Tronic Corporation , a provider of electronic manufacturing services (EMS), today announced that the Audit Committee of the Company’s Board of Directors (the “Audit Committee”) has completed its internal investigation, which was originally announced in February 2021. The Audit Committee, assisted by independent legal counsel and a forensic accounting firm, conducted […]
Expansion in Texas Manufacturing Picks Up, Costs Soar
Texas factory activity expanded at a faster pace in June, according to business executives responding to the Texas Manufacturing Outlook Survey. The production index, a key measure of state manufacturing conditions, rose 14 points to 29.4, a reading indicative of strong output growth. Other measures of manufacturing activity also pointed to accelerated growth this month. […]
Asia/Pacific Organizations Ramping Up CX Investments but Vendors Must Combat Privacy and Data Security Challenges, IDC Reports
SINGAPORE – In the new normal, organizations must address rising privacy concerns and regulatory scrutiny to capture the opportunities presented by increased customer data availability. According to IDC’s latest report Bridging Digital Trustworthiness Gaps to Address the Privacy-Versus-Value Dichotomy, organizations must increase capabilities required for digital trustworthiness, such as expertise in privacy protection, data security, and […]
Malaysia’s Indefinite Extension of MCO 3.0 Expected to Obstruct MLCC Supply, Particularly for High-End MLCC, Says TrendForce
The indefinite extension of Malaysia’s MCO (movement control order) 3.0 has posed severe challenges for the global MLCC market, according to TrendForce’s latest investigations. The high-end MLCC segment, in particular, is expected to suffer the most severe shortage, and products that feature high-end MLCC, such as smartphones, notebooks, networking products, server, and 5G base station […]
iNEMI 5G/mmWave Tech Topic Series Webinar: Enabling Thin Glass Solutions for 5G
iNEMI 5G/mmWave Tech Topic Series Enabling Thin Glass Solutions for 5G Aric Shorey (Mosaic Microsystems) / July 15, 2021 Thin glass substrates with fine-pitch through-glass via (TGV) technology provide attractive solutions for 5G wafer-level packaging and systems integration. Electrical and physical properties of glass offer advantages such as low RF loss, the ability to […]