iNEMI’s 1st Level Interconnect Void Characterization Project Reports Phase 1 Results
Phase 1 Report: 1st Level Interconnect Void Characterization Project February 2 & 3, 2021 Flip chip packages are key solutions that help drive high-density and improved interconnect for advanced electronics packaging. However, the formation of small voids (micro voids) can occur in solder-based flip chip joints during the assembly process, and these voids tend to […]
Versinetic launches Charging Blox to accelerate EV charge point rollout
Flexible hardware and software tools combine to create complete EV charge point solutions, providing a faster route to market for UK and EU smart charging point manufacturers Birmingham, 19 January 2021 – Electric vehicle (EV) charging consultancy, Versinetic, has announced the general availability of a suite of bespoke charging solutions aimed at accelerating the rapid rollout […]
North America Advanced Packaging Market 2026 – A USD 5 Billion Revenue Opportunity
The revenue of North America advanced packaging market crossed $3 billion in the year 2019 and is predicted to touch 5 billion-dollar mark till 2026, growing at 7% between the years 2020 and 2026; as per the research done by Graphical Research. One of the key drivers of the North America market is the availability […]