Strategies for PCB Reliability: How to Reduce Time, Spending, and Bandwidth
Tempo Automation is an electronics manufacturer for prototyping and low-volume production of printed circuit board assemblies. By developing and deploying proprietary factory automation software in its San Francisco-based smart factory, Tempo aims to change the way companies in aerospace, medical technology, industrial technology, automotive, and consumer electronics innovate and bring new products to market.
Qualcomm Retakes Market Leadership in 1Q20 Revenue Ranking of Global Top 10 IC Design Companies, Says TrendForce
According to the 1Q20 revenue ranking of global top 10 IC design companies compiled from TrendForce’s latest data, Qualcomm was able to stop the trend of continuous YoY revenue declines, which lasted for the six previous consecutive quarters, because of its effective 5G product strategy and the considerable growth in WFH and distance learning demand. […]
Elmatica CEO to Serve as Vice Chair for New IPC Cyber Security Task Group
“The goal of the IPC 2-12c Cybersecurity Protection Standard Task Group is to develop a new industry standard to provide a system to reduce the manufacturing supply-chain cybersecurity risks. We are pleased to have Didrik Bech and his experience within cybersecurity onboard as Vice Chair,” says Chris Jorgensen, Director Technology Transfer at IPC. IPC-1792, Standard […]
Ryder EMS Plant Implements 5S and Invests in Expanded Tooling Capabilities
Ryder Industries, an Electronics Manufacturing Service provider, has recently added substantial capabilities to its inland plant, in Jiangxi province, China. The company, which has always prided itself on high quality engineering, has invested 5 million RMB, approximately $700,000 US, in the renovation of their tooling department and the updating of twelve machines. The site now […]
Indium Corporation Expert to Present at ICEPT
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise during the 21st International Conference on Electronic Packaging Technology (ICEPT), Aug. 12-15 in Guangzhou, China. The demand for faster, more powerful devices in the electronics industry makes thermal management a high priority as the need for improved high-performance materials continues to grow. While […]