iNEMI Call-for-Participation Webinar

First Level Interconnect Void Characterization Project Two sessions scheduled December 12, 2019 Flip chip electronic packages are commonly used to address today’s high-density interconnect needs. However, the formation of small voids (micro-voids) can occur in solder-based flip chip joints during the assembly process and these voids tend to grow after multiple reflows. This can be […]

Virtual Engineering Center Awarded Major UK Nuclear Research Contract

The Virtual Engineering Centre (VEC) has been awarded a contract to support Phase 2 of the Government’s Digital Reactor Design (DRD) nuclear research programme. The £3.6 million project, led by global project, engineering and technical services company Wood, is funded by the Department for Business, Energy and Industrial Strategy (BEIS), to bring together experts from […]

mHospitals Launched in India to Enhance Healthcare Options for Rural Areas

Dr. Ashutosh Tiwari is a technocrat, researcher and entrepreneur who has founded the International Association of Advanced Materials (IAAM), one of the largest networks for advanced materials researchers. He is also the founder of VBRI , that offers smart technologies especially in the healthcare sector. Dr. Tiwari is one of the pioneers in the field […]