Wafer Capacity by Feature Size Shows Rapid Growth at <10nm, Reports IC Insights

Cellphone and graphics processors drive demand for leading edge processes.Leading-edge processes (<28nm) took over as the largest portion in terms of monthly installed capacity available in 2015.  By the end of 2019, <28nm capacity is forecast to represent about 49% of the IC industry’s total capacity, based on information in IC Insights’ Global Wafer Capacity 2019-2023 report. […]

SEHO to Show Innovations for Its Entire Range of Products at productronica

SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will exhibit in Hall A4, Booth #578 at the upcoming productronica, scheduled to take place Nov.12-15, 2019 in Munich, Germany. The company will showcase innovative features for its product range. The new functions are designed to bring process […]

ZESTRON will be Exhibiting at SMTA Guadalajara Expo

Manassas, VA –  ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will be featuring the recently released decoating cleaning agent, ATRON® DC at SMTA Guadalajara Expo & Tech Forum. ATRON® DC is a maintenance cleaning agent designed to remove conformal […]

Elements of Indium by Indium Corporation: Low-Temperature Performance

Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually limitless applications, indium metal is literally all around us. Not many metals have the ability to performs in harsh low-temperature environments like indium metal can. Traditional metals containing Sn or Pb fail at cryogenic temperatures (<-180°C). Because […]