Foxconn challenges Microsoft patent lawsuit
Originally published by DigiTimes Foxconn Electronics (Hon Hai) chairman Terry Gou has responded to a patent infringement lawsuit filed against his compoanny by Microsoft, saying as a contract manufacturer instead of a handset brand, it has never infringed upon patents as alleged by the US-based software giant and therefore has never needed to pay royalties […]
TTI and Molex Bring You ISI BGA Reballing and IC Adapter Technology
Fort Worth, Texas – TTI, Inc., a leading specialty distributor of electronic components now delivers enhanced supply chain solutions with Molex ISI BGA Reballing and IC Adapter Technology. Many modern ICs are often only available in RoHS/lead-free BGA packages. ISI has been audited and qualified as a production reballing supplier to the leading Tier 1 defense […]