Toshiba releases medium voltage, high current photorelay in small package
Latest trench MOSFET process delivers replacement for mechanical relays Düsseldorf, Germany, February, 2018 – Toshiba Electronics Europe has announced the launch of a new photorelay in a small 2.54SOP4 package that is just 2.1mm high with a 2.54mm pitch. Fabricated using the latest U-MOS VIII trench MOSFET process, the new TLP3145 combines an off-state output terminal voltage of […]
Nordson SELECT Integra™ 508.5 to Make its North American Debut at 2018 APEX
Integra™ 508.5 features unique parallel and double processing modes expanding selective soldering throughput and flexibility Spokane Valley, WA, USA – February, 2018 – Nordson SELECT, a Nordson company (NASDAQ: NDSN), is pleased to announce its Integra™ 508.5 will make its North American debut in Booth #2108 at the 2018 IPC APEX EXPO, scheduled to take place February […]