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Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

WHITE PAPER - Understencil Wipe Cleaning Yields Improvements

WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability

WHITE PAPER - Voiding Mechanisms in SMT

WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Optimizing Reflow Profile Via Defect Mechanisms Analysis

Effectively manage material obsolescence to avoid costly surprises

Probe Technologies to Improve First Pass Yields

How to better manage the complexity of LED binning with Valor

Optimizing Assembly of QFNs

Best Practice NPI, improve your return on investment

Reliability Challenges for Bottom Termination Components

Silicone Electrically Conductive Adhesives go Extreme Heat and Vibration No Match for New Class of ECAs

Extreme Production Planning




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China aims for semiconductor industrial output of CNY350 billion in 2015
Jul 25, 2014 - Since the implementation of China's 12th Five Year Plan in 2011, the country's semiconductor industry has shown a steady yearly revenue growth from CNY179.61 billion (US$29 billion) in 2010 to CNY240.8 billion in 2013
Worldwide Tablet Market Grows 11% in Second Quarter on Shipments from a Wide Range of Vendors, According to IDC
Jul 25, 2014 - The worldwide tablet grew 11.0% year over year in the second quarter of 2014 (2Q14) with shipments reaching 49.3 million units according to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Tablet Tracker.
Gartner Says Indias Mobile Services Market To Reach $19.2 Billion In 2014
Jul 24, 2014 - India's Mobile Connections To Reach 815 Million This Year
IDC MarketScape Positions Leaders, Major Players and Newer Entrants in the Worldwide Enterprise Videoconferencing Equipment Market for 2014
Jul 24, 2014 - International Data Corporation (IDC) has published its 2014 analysis of the worldwide enterprise videoconferencing equipment vendors.
News Publishing
ACD Increases Burn-in Capacity and Ramps up End-Consumer Support
Agilent Technologies’ PXIe Modular Vector Signal Test Solution Accelerates Smarter Micro’s Power Amplifier Development
API Technologies Wins New $2 Million Order for Next Generation Radar Indicator Solution
Ascent Solar Announces Launch of New EnerPlex(TM) e-Commerce Website
Libra Industries Awards More than $20K in Scholarships during 9th Annual Golf Outing
Lista Offers ListaWorks™ for Electronics Assembly Facilities
Miniature Lampholder from VCC Designed for Automotive, High Vibration Applications
New BlueWave LED System available from Ellsworth Adhesives Europe

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New IPC Report Highlights Business Implications of On-Shoring in North America


Nanotechnology Researchers Replace Solder with Water

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SMART Group to Present Real Life Look at Reliability and Standards

CEA Announces International CES Asia to Serve as Premier Asian Event
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Smartphone Charging to Consume Almost 14,000 Gigawatt-hours of Dirty Energy by 2019. view

MANA Research: A cool approach to flexible electronics
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Greater Automation of Testing Will Help Flexible and Rigid Electronic Manufacturers Improve Product Quality and Decrease Costs
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Previous Column:
WHITE PAPER - Voiding Reduction in Bottom Terminated Components (BTC) with Improved Flux Coating

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The Dawning Resurgence of a Mexican Outsourced Manufacturing Model
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New IPC Group Focuses on Inexpensive Protection Technologies for Electronic Assemblies

EMS People
Wolfgang Mueller, ASYS at SMT 2014 view

Rob Raine, DEK at SMT 2014

Order of Protection: People, Planet, then Product? view

Previous Column:
Keep the Pressure on Electronics-Industry Associations

In Conversation
Rick Goldsmith, DEK at SMT 2014 view

Mark Stansfield, SolderStar at SMT 2014

Assembleon, Asymtek, Mydata, Siemens, Transition Automation


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