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WHITE PAPER - Conformal Coating Process Characterization Considerations

WHITE PAPER - Complete Verification for PCB Assembly

How to keep your competitive edge in manufacturing’s high growth automotive electronics

Fundamental Challenges of PCB Assembly and Test

Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

WHITE PAPER - Understencil Wipe Cleaning Yields Improvements

WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability

WHITE PAPER - Voiding Mechanisms in SMT

WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Optimizing Reflow Profile Via Defect Mechanisms Analysis

Effectively manage material obsolescence to avoid costly surprises

Probe Technologies to Improve First Pass Yields

How to better manage the complexity of LED binning with Valor

Optimizing Assembly of QFNs

Best Practice NPI, improve your return on investment

Reliability Challenges for Bottom Termination Components

Silicone Electrically Conductive Adhesives go Extreme Heat and Vibration No Match for New Class of ECAs

Extreme Production Planning




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2015 Semiconductor Sales Leaders Forecast to Include NXP/Freescale; One Japanese Company
Apr 17, 2015 - Total top 10 marketshare of semiconductor industry now back over 50%.
SMTA Announces Pan Pacific Symposium Call for Papers
Apr 17, 2015 - The Surface Mount Technology Association (SMTA) has issued a call for papers for the 2016 Pan Pacific Microelectronics Symposium, which will be held 25 - 28 January 2016 on the Big Island of Hawaii.
Gartner Highlights Five Reasons Why a Modern Data Center Strategy Is Needed for the Digital World
Apr 16, 2015 - As a new digital world emerges from the dual impact of the Nexus of Forces and the Internet of Things, the personality, structure and role of data centers will need to be changed or business agility and competitive strength will be compromised
Gartner Says Security Analytics May Be Key in Breach Detection
Apr 16, 2015 - Analysts to Discuss Emerging Security Trends and Technologies at Upcoming Gartner Security and Risk Management Summits
News Publishing
Alpha Presenting LED Technical Papers at Upcoming SMTA Conferences in Malaysia and China
Ersa to Highlight the Smartflow 2020 in Toronto
Fuji do Brasil Awards BTU International for 16-Year Partnership
ISRI to Present LG Electronics with 2015 Design for Recycling® Award
Multitest has shipped first 45° high g sensor test module for kitable MT9928 gravity handler
Super Dry Expands Network in The Southwest. Signs Sales Agreement with Torenko & Associates
Valtronic to Sponsor Long Beach Walk4Hearing Event

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IPC APEX EXPO Named in Trade Show News Network's Top 250 Trade Show List
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North American PCB Book-to-Bill Ratio Strengthens

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Wireless Sensor Networks: Bringing Order Out of a Hot Mesh view

‘QFRC’ is a Magic Word for Lean in Finance
EMS People
Chris Thyen, Vice President of Global Business Development, Kimball Electronics at APEX 2015 view

Brian D'Amico, President of Mirtec Corp at APEX 2015
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Register now for the EIPC Summer Conference June 18 & 19 view

NEPCON China 2015 Convenes Leading Electronics Industry Players
In Conversation
Automotive Electronics Roundtable, hosted by ASM Assembly Systems at APEX 2015 view

Charlie Barnhart at APEX 2015
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Don't Talk About Industry 4.0 – Removing Physical Barriers
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Conflict Minerals – an exercise in complexity

 Regional Manufacturing: from Philosophy to Practice view

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Getting Hands-on Experience in Sustainable Product Design

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Global Solar PV Capacity to Reach Nearly 500 GW in 2019, IHS Says


Revenue for Leading Solar PV Module Suppliers Reached Three-Year High in Q4’14


Assembleon, Asymtek, Mydata, Siemens, Transition Automation


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