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WHITE PAPER - Complete Verification for PCB Assembly

How to keep your competitive edge in manufacturing’s high growth automotive electronics

Fundamental Challenges of PCB Assembly and Test

Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

WHITE PAPER - Understencil Wipe Cleaning Yields Improvements

WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability

WHITE PAPER - Voiding Mechanisms in SMT

WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Optimizing Reflow Profile Via Defect Mechanisms Analysis

Effectively manage material obsolescence to avoid costly surprises

Probe Technologies to Improve First Pass Yields

How to better manage the complexity of LED binning with Valor

Optimizing Assembly of QFNs

Best Practice NPI, improve your return on investment

Reliability Challenges for Bottom Termination Components

Silicone Electrically Conductive Adhesives go Extreme Heat and Vibration No Match for New Class of ECAs

Extreme Production Planning




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News Publishing
Global TV Shipments Rebound, LCD Growth Significantly Improves, According to DisplaySearch
Nov 26, 2014 - Led by continued strong demand in North America, global TV shipments grew more than 4% last quarter, after several quarters of weak growth
Worldwide Tablet Growth Expected to Slow to 7.2% in 2014 Along With First Year of iPad Decline, According to IDC
Nov 26, 2014 - The worldwide tablet market is expected to see a massive deceleration in 2014 with year-over-year growth slowing to 7.2%, down from 52.5% in 2013, according to a new forecast from International Data Corporation (IDC)
Gartner Says More Than a Third of U.S. Adult Smartphone Users Use Their Smartphones for Video Calling
Nov 25, 2014 - Video Calling Is Growing Into a Key Mainstream Activity on Smartphones
Intel CEO Brian Krzanich Elected Chairman of Semiconductor Industry Association
Nov 25, 2014 - The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, has announced that the SIA board of directors has elected Brian Krzanich, CEO of Intel, as its 2015 chairman
News Publishing
A-Laser to Highlight New Capability for the MID Market at the BIOMEDevice Show
Camtek's 3D Functional InkJet Technology System, Gryphon, Successfully Concludes a Beta-Test
FSInspection Appoints Circuit Technology, Inc. in the Carolinas
JAVAD EMS Adds Fourth Nordson YESTECH AOI System to Its Repertoire of Advanced Technologies
JOT Automation Debuts Modular Solutions for Product Identification
Toshiba Extends Series of Compact SiC Hybrid Power Modules to 3300V and 1500A


Reflecting on Linda Gee’s Sustainable -Tech Wins view

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A Welcome and Honest New Book on Outsourcing the Supply Chain

EMS People
Kamran Iqbal, Product Marketing Manager, Nikon at electronica 2014 view

François Beauxis, Managing Director, Lacroix Electronics at electronica 2014
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Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to Cover More Advanced Technologies
Full Story

Previous Column:
How To Place PCB Terminations Correctly

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WHITE PAPER - Complete Verification for PCB Assembly


White Paper: The Internet of Things (IoT) is Accelerating Connected Health

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SMTA International 2015 Electronics Exhibition Booth Space 75% Sold Out view

Automotive Technologies Drive Innovation at the 2015 International CES
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Don’t Talk About Industry 4.0! The Factory 4.0 Tour
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How to Place Breakaway Rails in a PCB Design

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Industry 4.0: It’s not too late to jump on board view

Solar PV Growth Rates Grab Headlines But Shipment Volumes Remain the Ultimate Goal
In Conversation
Rob DiMatteo, Regional Sales Manager, BTU International at SMTAI 2014 view

Pete Ruth, North American Business Manager, Conecsus at SMTAI 2014

Assembleon, Asymtek, Mydata, Siemens, Transition Automation


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