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Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

WHITE PAPER - Understencil Wipe Cleaning Yields Improvements

WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability

WHITE PAPER - Voiding Mechanisms in SMT

WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Optimizing Reflow Profile Via Defect Mechanisms Analysis

Effectively manage material obsolescence to avoid costly surprises

Probe Technologies to Improve First Pass Yields

How to better manage the complexity of LED binning with Valor

Optimizing Assembly of QFNs

Best Practice NPI, improve your return on investment

Reliability Challenges for Bottom Termination Components

Silicone Electrically Conductive Adhesives go Extreme Heat and Vibration No Match for New Class of ECAs

Extreme Production Planning




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CEA Announces International CES Unveiled Coming to Tokyo on Feb. 18
Oct 21, 2014 - Regional tech community to gather for new CES Unveiled Tokyo
Consumer PC Shipments Helped the Asia/Pacific PC Market in Q3 2014, But The Overall Market Is Still Contracting, IDC Reports
Oct 21, 2014 - Consumer PC Shipments Helped the Asia/Pacific PC Market in Q3 2014, But The Overall Market Is Still Contracting, IDC Reports
Gartner Says Worldwide Semiconductor Capital Spending to Increase by More Than 11 Percent in 2014
Oct 20, 2014 - Memory Manufacturers Enjoy Strong Pricing Environment, Setting Stage for Renewed Spending Growth
New Portfolio of Decision Making Methodologies from IDC Help Organizations Successfully Lead 3rd Platform Technology Initiatives
Oct 20, 2014 - IDC DecisionScape brings together complex bodies of knowledge within a single viewpoint to aid in each stage of decision making
News Publishing
ACME PCB Assembly Partners with Ersa for Reworking Large PCBs
CyberOptics Brings World-Class SPI and AOI Inspection Solutions to Matelec in Spain
IDEA Counterfeit Mitigation and Inspection Training by EPTAC at Advanced MP Technology
New 14 Slot SBS Architecture Expands Compact COTS Packaging Capabilities
Small cell microwave backhaul pioneer CCS expands deployment with China Mobile
Stackpole Releases Precision Anti-corrosive Thin Film Chip Resistor Sample Kits
XJTAG releases boundary scan for Teradyne TestStation

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Industry 4.0: It’s not too late to jump on board view

Solar PV Growth Rates Grab Headlines But Shipment Volumes Remain the Ultimate Goal
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News From the EIPC - October
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Don’t Talk About Industry 4.0! Resistance To Change Is Futile

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Session Two of the IPC & SMTA High-Reliability Cleaning & Conformal Coating Conference to Focus on Ultra-Thin and Nano-Coatings view

Daimler Chairman Dr. Dieter Zetsche to Deliver Keynote Address at 2015 CES
In Conversation
Rob DiMatteo, Regional Sales Manager, BTU International at SMTAI 2014 view

Pete Ruth, North American Business Manager, Conecsus at SMTAI 2014
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Deliver Best Practices: Importance of LEAN in Driving Innovation
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Teens and Tech: A Growing Market for Wearables

EMS People
Brian Smith and Jeff Timms of ASM Assembly Systems at SMTAI 2014 view

Coco Zhang of BTU International at NEPCON South China
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What is a PCB Design "Floorplan"?


IPC Study Examines Potential Spots for Global Expansion/font>

A Welcome and Honest New Book on Outsourcing the Supply Chain view

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Preservative-free Diodes and Non-GMO Capacitors


Assembleon, Asymtek, Mydata, Siemens, Transition Automation


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