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Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

WHITE PAPER - Understencil Wipe Cleaning Yields Improvements

WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability

WHITE PAPER - Voiding Mechanisms in SMT

WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Optimizing Reflow Profile Via Defect Mechanisms Analysis

Effectively manage material obsolescence to avoid costly surprises

Probe Technologies to Improve First Pass Yields

How to better manage the complexity of LED binning with Valor

Optimizing Assembly of QFNs

Best Practice NPI, improve your return on investment

Reliability Challenges for Bottom Termination Components

Silicone Electrically Conductive Adhesives go Extreme Heat and Vibration No Match for New Class of ECAs

Extreme Production Planning




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Gartner Says Service Providers Hold the Key to Their Success in the Digital Era
Jul 31, 2014 - Digital Business Incompetence Will Cause 25 Percent of Businesses to Lose Market Position
IPC PERM Council Addresses Lead-Free Concerns in High-Reliability Electronics
Jul 31, 2014 - IPC and Celestica announce that the IPC Pb-free Electronics Risk Management (PERM) Council is meeting in Toronto, Canada, July 22–24, to discuss lead-free conversion issues
Chinese Vendors Outpace the Market as Smartphone Shipments Grow 23.1% Year over Year in the Second Quarter, According to IDC
Jul 30, 2014 - The worldwide smartphone market grew 23.1% year over year in the second quarter of 2014 (2Q14), establishing a new single quarter record of 295.3 million shipments
European Providers Still Testing the Waters of Big Data, According to IDC Health Insights Survey
Jul 30, 2014 - A new survey by IDC Health Insights shows that European healthcare providers are still uncertain about the benefits of investing in Big Data and analytics (BDA) technologies.
News Publishing
Ascent Solar Announces Preliminary Q2 Revenue Results - EnerPlex(TM) Quarterly Sales Reach $1M
Graphicode’s GC-Prevue v22.3 supports new Gerber X2 format
Huawei signs global deal with Ranplan for small cell network planning and optimisation
Nordson DAGE and Nordson YESTECH to Display Market Leading AOI, Bond Test and X-ray Inspection Systems at NEPCON South China
Tektronix Adds Support for Automated APCO P25 Transmitter Compliance Testing
TRI Partners with Yokogawa in Japan Market
ULT Website Redesigned and Restructured

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White Paper Simplifies Comparison of Lead-free Alloys


New IPC Report Highlights Business Implications of On-Shoring in North America

EMS People
Vitor Barros, KIC Thermal at SMT 2014 view

Wolfgang Mueller, ASYS at SMT 2014
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Manufacturing is the Next Technology
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Greater Automation of Testing Will Help Flexible and Rigid Electronic Manufacturers Improve Product Quality and Decrease Costs

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Embedded Masterclass returns

SMART Group to Present Real Life Look at Reliability and Standards
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Smartphone Charging to Consume Almost 14,000 Gigawatt-hours of Dirty Energy by 2019. view

MANA Research: A cool approach to flexible electronics
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The Dawning Resurgence of a Mexican Outsourced Manufacturing Model
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New IPC Group Focuses on Inexpensive Protection Technologies for Electronic Assemblies

Order of Protection: People, Planet, then Product? view

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Keep the Pressure on Electronics-Industry Associations

In Conversation
Rick Goldsmith, DEK at SMT 2014 view

Mark Stansfield, SolderStar at SMT 2014

Assembleon, Asymtek, Mydata, Siemens, Transition Automation


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