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Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

WHITE PAPER - Understencil Wipe Cleaning Yields Improvements

WHITE PAPER - Measuring Tiny Solder Deposits with Accuracy and Repeatability

WHITE PAPER - Voiding Mechanisms in SMT

WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Optimizing Reflow Profile Via Defect Mechanisms Analysis

Effectively manage material obsolescence to avoid costly surprises

Probe Technologies to Improve First Pass Yields

How to better manage the complexity of LED binning with Valor

Optimizing Assembly of QFNs

Best Practice NPI, improve your return on investment

Reliability Challenges for Bottom Termination Components

Silicone Electrically Conductive Adhesives go Extreme Heat and Vibration No Match for New Class of ECAs

Extreme Production Planning




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IDC Lowers Tablet Projections for 2014 as Demand in Mature Markets Levels Off
Sep 01, 2014 - Following a second consecutive quarter of softer than expected demand, International Data Corporation (IDC) has lowered its worldwide tablet plus 2-in-1 forecast for 2014 to 233.1 million units.
Semiconductor Market Setting Sales Records through the First Half of 2014
Sep 01, 2014 - As SIA reported earlier this month, worldwide sales of semiconductors reached $82.7 billion during the second quarter of 2014, marking the industry's highest-ever second quarter sales total.
More 4K UHD TV Sets Shipped in Q2'14 than in All of 2013, says NPD DisplaySearch
Aug 29, 2014 - More 4K ultra-HD (UHD) TV sets were shipped in Q2'14 than shipped all year in 2013. According to the NPD DisplaySearch Quarterly Global TV Shipment and Forecast Report, 2.1 million sets were shipped in Q2, compared to 1.6 million in 2013.
Smartphone Outlook Remains Strong for 2014 According to IDC
Aug 29, 2014 - According to a new mobile phone forecast from the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker, more than 1.25 billion smartphones will be shipped worldwide in 2014.
News Publishing
Aqueous Technologies to Present at the Assembly Cleaning, Coating and Reliability Workshop
Ellsworth Adhesives Exhibiting at Medical Electronics Symposium
FCT Assembly to Exhibit Solution-Driven Solder Pastes at the SMTA Capital Expo
PARMI Announces New SPI Defect Repair Feature for SIGMA X
Tech Systems to Represent Europlacer in SoCal and Baja Territories

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Leading Chinese Solar PV Module Suppliers Continue to Increase Market Share, According to NPD Solarbuzz


Solar Cell Production Line Upgrade Cycle Driving Module Powers to Record Highs.

In Conversation
Ron Keith of Riverwood Solutions shares his views at SemiconWest view

Rick Goldsmith, DEK at SMT 2014
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What's Next for the Internet?
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Internet of Things is Connecting People to Better Health

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Shouting Louder to Gain Attention - Thoughts from NEPCON South China view

Start networking at the ISN Conference
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DEK & SIPLACE form ASMPT’s SMT Solutions Business Segment
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Don’t Talk About Industry 4.0! The Customer Perspective

EMS People
Future Growth Facing the Consumer Electronics Industry view

Rolf Blömer, Head of German Cluster, ASM Assembly Systems at SMT 2014

Outsmarting Waste in Electronics view

Previous Column:
Order of Protection: People, Planet, then Product?

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Research highlight from MANA, the International Center for Materials Nanoarchitectonics at NIMS, Tsukuba, Japan view

Smartphone Charging to Consume Almost 14,000 Gigawatt-hours of Dirty Energy by 2019.

Assembleon, Asymtek, Mydata, Siemens, Transition Automation


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