ZESTRON Academy Announces Webinar on Defluxing Ultra-Fine Pitch Die on CoW Packages July 20

ZESTRON, a leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is excited to announce an upcoming webinar titled, “Enhancing Yield and Reliability of Ultra-Fine Pitch Die through Defluxing on CoWs” on July 20th, 2023, at 2:00 PM EST.

This informative webinar will focus on the critical step of defluxing ultra-fine pitch die on chip-on-wafer (CoW) packages in the manufacturing process of microelectronics. The study will be presented by Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, who will discuss the challenges presented by the small size and proximity of the interconnects on CoW packages.

Mr. Parthasarathy will investigate the appropriate cleaning solution and process parameters required to effectively remove the flux residues without damaging the delicate interconnects on CoW packages with a 10µm bump pitch and 10µm gap height between a top die and bottom silicon wafer. The study will provide valuable insights into the defluxing process, enabling the production of high-quality microelectronics with improved reliability and performance.

This webinar is a must-attend for engineers, quality control personnel, and other professionals involved in the manufacturing of microelectronics. Participants will have the opportunity to ask questions and receive expert guidance from Mr. Parthasarathy, as well as gain valuable insights into the latest defluxing technologies and best practices for optimal performance.

Registration is free and available HERE. Don’t miss this opportunity to learn from one of the industry’s leading experts on defluxing ultra-fine pitch die on CoW packages.

x Brown

About The Author