Toyochem to Highlight Electronics Assembly Solutions at NEPCON JAPAN
Toyochem Co., Ltd., a member of the Toyo Ink Group, announced today that it will be exhibiting at the 47th NEPCON JAPAN, Asia’s Largest Exhibition for Electronics Design, R&D and Manufacturing Technology. The trade exhibition will take place January 17 to 19, 2018, at the Tokyo Big Sight. Toyochem, at its booth E19-17 in the East Hall, will showcase a comprehensive lineup of innovative material solutions developed to address the demands of the global electronics industry for greater miniaturization and the advances in flexible circuitry design.
Key Products on Display
Toyochem’s LIOELM™ TSS™ series of electromagnetic wave shielding films ensure excellent folding endurance, flexibility and low resilience, due to the well-dispersed conductive fillers adopted in the company’s unique heat-resistant adhesive. The TSS series provides superior performance as a countermeasure against electromagnetic noise radiated in flexible printed circuits and other electronic equipment.
Visitors to the booth can learn more about Toyochem’s extensive adhesives portfolio for the shielding, bonding, protecting, insulating of electronic devices. The LIOELM™ TSC™ conductive adhesive sheet exhibits high moisture, heat resistance and excellent shielding performance, making it suitable for mounting purposes. The LIOELM™ FTS series of thermally conductive adhesive sheets is ideal for use as a countermeasure against heat.
Toyochem also offers a broad range of dielectric products used in semiconductor manufacturing. Engineered using Toyochem’s proprietary polymer, the LIOELM™ TCL series of low dielectric adhesive sheets provides excellent insulation and heat resistance. The booth will also feature low dielectric resin materials that can be applied in a variety of industrial applications.
Among other advanced solutions will be products to improve electromagnetic compatibility, clear two-part curable coatings with good bending resistance, pressureless and high heat-resistant bonding with nano-Ag paste, highly durable optically clear adhesives for automobiles, and sensing systems.