Woychik’s presentation will highlight the role of hybrid bonding in supporting die-to-wafer and wafer-to-wafer in delivering high-density, low-latency interconnection technology for multi-chiplet integration in advanced packaging
ROSEMONT, IL – At the upcoming SMTA International Conference, NHanced Semiconductors vice-president Dr. Charles Woychik will present “The Future of Electronics Packaging is Chiplet Architecture,” describing the industry’s ongoing transition from monolithic system-on-chip (SoC) designs to chiplet-based architectures, driven by demands for increased functionality, heterogeneous integration, and improved performance-per-watt in emerging applications such as AI accelerators, high-bandwidth memory (HBM) stacks, and multi-die data center processors.
A critical technology to implement high-density, low-latency interconnect technologies capable of supporting multi-chiplet integration within a single package, hybrid bonding, delivers superior electrical, thermal, and mechanical performance compared to conventional micro-bump and thermocompression bonding methods. Hybrid bonding enables direct copper-to-copper (Cu-Cu) and dielectric-to-dielectric interfaces between dies or chiplets at sub-10µm pitches, dramatically increasing interconnect density while reducing parasitic resistance, capacitance, and interconnect latency.
Key challenges in hybrid bonding assembly include maintaining sub-micron alignment accuracy, managing wafer warpage, ensuring oxide planarity, and mitigating void formation at the bonding interface. The evolution of bumpless interconnect schemes and adoption of open die-to-die interface standards (such as UCIe) further establish hybrid bonding as a cornerstone technology in next-generation chiplet-based packaging platforms. Woychik’s presentation will review the current state, process integration challenges, and future trends in hybrid bonding for chiplet assembly.
The 2025 SMTA International Conference will be held at the Donald E. Stephens Convention Center in Rosemont, IL from October 19 – 23, 2025. The conference is organized by SMTA as part of its focus on supporting all aspects of electronics manufacturing technology. The conference offers practical, research-based content on topics such as materials and process reliability, advanced packaging, AI in manufacturing, counterfeit detection, sustainability, and yield improvement strategies. In addition to the educational sessions, SMTA International includes an exhibition hall, technical roundtables, a keynote presentation on cultivating a sustainable and agile culture of innovation, and networking receptions.
About NHanced Semiconductors, Inc.
Based in the US, NHanced Semiconductors is the world’s first pure-play advanced packaging foundry, specializing in leading-edge BEoL semiconductor technologies. Its capabilities include chiplets, 3D-ICs, silicon interposers, 2.5D, additive silicon manufacturing, photonics, microfluidics, and other innovative technologies. The foundry works with both standard and non-standard substrates, III‑V compound semiconductors, and many specialized materials.
Headquartered in Illinois, NHanced has a development and manufacturing facility near Research Triangle Park, NC, performing manufacturing, in-house process development, and customer prototyping, as well as a volume interposer and assembly facility in Odon, IN. For more information, please visit: https://nhanced-semi.com/
