Technology’s Future Comes Together at APEX 2019
Opening Keynote Speaker JB Straubel to Highlight Tesla’s Success in Disrupting and Accelerating Innovation
Each year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2019 will feature JB Straubel, chief technical officer (CTO) and co-founder of electric vehicle maker Tesla, Inc. Straubel will present “Accelerating and Disrupting Innovation: The Tesla Story” on Tuesday, January 29.
At Tesla, Straubel focuses on technical direction and engineering design including battery technology, power electronics, motors, software, firmware and controls. He also launched many Tesla initiatives including: the Tesla Energy business providing grid storage for commercial utilities and residential consumers; the worldwide Tesla Supercharger network of fast DC chargers; and the Tesla Gigafactory which is leading the way toward increasing worldwide battery production and lowering the cost per kWh. He also has responsibility for new technology evaluation, R&D and technical diligence review of key vendors. Breaking through barriers to innovate faster and better has been Straubel’s strength.
In his presentation, Straubel will draw on his extensive experience and share the history of Tesla, detailing that innovation wasn’t an add-on to its operations but woven into every element of the business. He will also answer the perennial question, “How can my organization re-engineer itself to create products and ideas that answer 21st century needs?
Straubel’s opening keynote is free to all registered IPC APEX EXPO attendees.
And Don’t Forget the Exhibition!
On Tuesday, attendees can visit nearly 500 exhibits amid countless opportunities for networking at one of the industry’s most important events. Learn about the latest technologies from companies like these, who will be on hand to demonstrate their most innovative products and services:
Aegis Software Unveils the First MES Solution that Enables Middleware-Free IIoT Manufacturing via the IPC CFX Standard . Aegis’ CFX-Enabled FactoryLogix platform leverages CFX from data acquisition to analytics and process control automation. As a result, any manufacturer on the FactoryLogix platform that purchases a CFX-compliant device, machine or system will instantly consume, interpret, and leverage the mission-critical information from those devices without the need for any middleware or custom integration. The emergence of CFX combined with an MES that natively understands the data streams ushers in the era of true IIoT, which is an enterprise that is free of the need for custom middleware to get data from the factory floor. Now manufacturers of all sizes will be able to fast-track the actual realization and transformative benefits of Industry 4.0. Aegis Software will be operating in the live demonstration of the IPC CFX standard at Booth #4420 and also showcasing their FactoryLogix solution at Booth #2921.
Cogiscan Inc., a leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, will launch Geoscan, its new geolocation system, with a live demo in Booth #3145 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center in CA.
Geoscan is an Asset Location System that aims at monitoring, in real-time, the location of critical assets in the factory. It shows the precise location of the asset on a factory map, and it records the complete history of displacements including past locations, distances, etc.It integrates with the Cogiscan Track, Trace and Control platform for inventory visibility, process control and traceability. The geolocation system also can interface with third party software solutions through an API.
The Geoscan system runs on the standard Cogiscan platform, which means that it is a very simple upgrade for existing Cogiscan customers. With the largest library of machine interfaces in the industry, Cogiscan can deliver a complete solution; including connectivity and applications such as material control, traceability and analytics.
Creative Electron Bring the New TruView™ Fusion AXI to APEX and to the CFX Line
The TruView™ Fusion AXI will be working at the CFX line as a part of IPC’s a demonstration of the next generation Smart SMT line, ready for Industry 4.0.
Designed for the high mix SMT environment, the TruView™ Fusion AXI has a “one-button” program interface and a fully automated operation and is intuitive and easy to use so the user will not need to become x-ray experts.
Creative Electron President, Dr. Bill Cardoso says, “even if you aren’t looking for an inline x-ray machine, you will want to buy efficiency for your line, and that’s exactly what the TruView™ Fusion AXI gives you.” Adding, “you can quickly turn data into information, information into action, and action into performance improvements that drive return on investment”.
Griffin Lemaster, Creative Electron’s COO added, “your next AXI system has to be a source of information, not of bottlenecks. With a 25 second cycle time, the TruView™ Fusion AXI can keep up with the fastest lines.”
Integration into the line is key to successfully using data from inspection to improve performance, and having the CFX line at APEX creates the ideal opportunity to show the TruView™ Fusion AXI in a real line situation and the value that can be derived from using multiple inspection sources.
As well as an appearance on the CFX line Creative Electron’s expert team will be in booth #1525 on the show floor where they will be exhibiting their TruView™ Prime benchtop x-ray and their TruView™ Parts Counter AI, the first parts counter on the market using artificial intelligence to generate more accurate information and detect counterfeit components.
You can learn more about all of these products at Creative Electron at www.creativeelectron.com
Henkel Corporation will debut several new materials featured as part of six different display and demo areas within booth #907. Highlighting the breadth of its portfolio and the company’s ability to deliver complete material sets for demanding applications, Henkel’s Solutions Across the Board exhibit allows show delegates to see materials in action and discuss specific requirements with the knowledgeable Henkel technical team. At Henkel’s booth, visitors can learn more about:
- New LOCTITE® solder materials and fluxes for high-reliability automotive applications, as well as temperature-stable LOCTITE GC formulations for low voiding on QFNs and LGAs and jetting for ultra fine-pitch architectures and flexible substrates.
- Low pressure molding TECHNOMELT® to facilitate automated masking of keep out zones prior to conformal coating processes and to provide a simple, three-step, potting alternative for electronic device encapsulation. Live molding demonstrations will take place throughout the show in booth #907.
- BERGQUIST® thermal control solutions in liquid and pad formats ensure effective heat dissipation for increased reliability. The newest product in Henkel’s TIM portfolio, BERGQUIST GAP PAD® TGP 7000ULM, delivers the unique properties of ultra-low assembly stress and high thermal conductivity (7.0 W/m-K) and is ideal for today’s Telecom, Power, Automotive and Consumer applications.
- PCB Protection from a wide range of solvent-free conformal coatings, which safeguard printed circuit boards from thermal shock, moisture, corrosive liquids and other adverse environmental conditions.
- High-temp compatible device protection with LOCTITE® ECCOBOND® UF 1173 underfill, which combines a high Tg (160°C) with a solder-like low CTE for maximum protection in extreme conditions. The material, which is one of only five products selected for an IPC APEX Expo Innovation Award, also complies with current REACH substances of very high concern (SVHC) guidelines and contains no reportable carcinogenic, mutagenic or toxic for reproduction substances (CMRs).
- Structural adhesives, inks and electrically conductive adhesives that enable modern designs for wearables, streamlined medical devices and incabin automotive comfort and functionality. • Novel EMI conformal shielding materials offer a thin, streamlined replacement for conventional and cumbersome RF isolation approaches. See a live EMI spray coating demonstration in Asymtek booth #2125. As part of IPC APEX Expo’s technical conference, key members of Henkel’s expert team will share their materials and process knowledge during three paper presentations:
- Thermal materials specialist and Principal Scientist, John Timmerman, Ph.D., will present his work entitled “The Effects of Filler Morphology on the Fracture Toughness of Thermally Conductive Adhesives” on Wednesday, January 30th at 10:30 a.m.
- Addressing advances in medical devices and the materials used to facilitate smaller, smarter designs, Senior Technical Service Engineer, Jeffrey Grover, shares details on medical sensor manufacturing in his paper “Printed Electronics for Medical Devices” on Wednesday, January 30th at 3:30 p.m.
- As part of its collaborative work with supplier partners, Henkel’s development efforts in the area of package-level EMI shielding will be discussed during the “Dispensing EMI Shielding Materials: An Alternative to Sputtering” presentation delivered by Asymtek’s Garrett Wong on Tuesday, January 20th at 1:30 p.m. IPC APEX Expo show delegates are invited to learn more about specific Henkel solutions by visiting the team in booth #907 throughout the three-day event.
ICAPE Group invites APEX attendees to visit the team at Booth #611 this year. ICAPE Group has 19 years experience in the production of Printed Circuit Boards and customized Technical Parts manufactured in China. Now 1700 customers in 70 countries trust the quality services and products of the group. Each month, ICAPE Group delivers 22 million PCBs and 5 million Technical Parts. In 2018, ICAPE Group achieved a turnover of EUR 125M and aims for a growth of 20% in 2019. With its team of 340 people worldwide and 75 strategic partners in Asia, 25 in Printed Circuits and 50 in Technical Parts, ICAPE Group brings the best supply solutions.
The service office is located in China (Dongguan) with 185 highly qualified employees. Our global sales organization allows us to be closer to the production plants and to satisfy your needs in Printed Circuits Boards and Technical Parts, with the best quality / price / service ratios, while respecting the ethical charter established by the group on all its partners. To expand its presence ICAPE Group opened other offices in 2016 in Mexico City, Modena in Italy, Singapore, California and CIPEM USA. ICAPE Group integrated the American PCB & PCBA expert: DIVSYS to better serve its American customers by providing local sales & technical support with an in-house laboratory.
ICAPE Group focuses on developing its online presence and continues to better serve its customers. If you want to buy Printed Circuit Boards online, connect on www.icape-shop.com. You can also order customized Technical Parts to assemble your electronics on our platform www.cipem-shop
As ‘Your Partner for Smart Factory Realization,’ Koh Young Technology will show how its true 3D solutions can improve production throughput and yield at the IPC APEX Expo This year, Koh Young will display an array of new inspection systems with expanded capabilities at Booth 1908 in the San Diego Convention Center.
Leveraging its core strengths in robotics and true 3D measurement, Koh Young will bring the next generation of accuracy to the pin inspection, machined parts, and semiconductor inspection markets. The new Koh Young KY-P3 delivers true 3D inspection data for single array, forked, press-fit, and other pin configurations for Final Optical Inspection (FOI) with applications like engine control units. The system also measures pin height, solder height, and pin tip separation with the highest accuracy and repeatability.
Koh Young will also highlight its latest Machining Optical Inspection (MOI) system. Developed around its core 3D measurement technologies, the MOI system inspects metal case surfaces for scratches, cracks, and stains, along with height, diameter, volume, and more. Committed to bringing about “Smart Manufacturing” innovations, the MOI system delivers both visual and process inspection simultaneously, which improves process yield and reduces false calls.
Beyond pin and machined part inspection capabilities, Koh Young will present the latest Meister D solution focused on the SiP (System-in-Package) assembly process. The new machine improves production yields on high density modules comprised of bare die and passives by integrating defect analysis and metrology software. With small sized component inspection down to 008004 inch, the system overcomes challenges in semiconductor packaging, which are compounded by chip stacking and wafer thinning. What’s more, the system also allows machine learning-based crack inspection.
As the absolute leader in 3D inspection market, Koh Young will also take part in several show activities like topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at Booth 1908, you can learn more about Koh Young Technology and its best-in-class inspection solutions at www.kohyoung.com
- A new, modular conformal coating line that demonstrates process stability with consistency at each step. Coating productivity can be easily monitored, thanks to inter-machine communication between the Select Coat® SL-940 conformal coating system, the FX-942UV Series ACI/AOI automated conformal coating inspection system, and an integrated oven. Flexible configurations make it easy to create the right solution.
- Nordson ASYMTEK’s Vantage™ Fluid Dispensing System combined with the award-winning IntelliJet® jetting system. This dynamic duo demonstrates remarkable speed and accuracy in an expanded dispense area for applications in high-volume electronics manufacturing. New from the ground up, the Vantage dispensing system is controlled by the completely new dispensing software, Canvas™, with graphical programming and guided wizards.
- The Helios™ SD-960 Series automated dispensing system, which was specifically designed for high-throughput and batch dispensing in electronics assembly for large parts and PCB substrates. It dispenses medium to bulk volumes of both single- and 2-component highly abrasive thermal interface materials (TIMs), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives. The system incorporates Nordson ASYMTEK’s 35+ years of dispensing innovation, proven closed-loop process controls, dispense valves, user-programmable Windows-based PC with Fluidmove® software, and delivers the same unparalleled control, accuracy, repeatability, traceability, and flexibility as its micro-dispensing systems.
Saki will present its 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) systems, plus new 2D Bottom-side AOI, at IPC APEX Expo 2019 at booth #1407. In addition, Saki’s M2M communication/Industry 4.0/Smart Factory capabilities will be on display in the Fuji booth #1317 and in the Hermes/CFX production line.
Saki’s 3Di Series is the fastest AOI system in the industry. It has scalable resolutions of 7µm, 12µm, and 18µm, closed-loop functionality, and a sturdy frame with a dual-drive system, resulting in accuracy, stability, and reliability.
Demonstrations of Saki’s new version of Saki Self-Programming Software (SSP), the inspection industry’s first self-programming software, will be given. With Saki Self-Programming Software, no programming is necessary, no golden board is needed, and programming errors are eliminated.
New at IPC APEX is Saki’s 2D Bottom-side AOI System. Saki’s proprietary 2D high-speed imaging technology scans an entire 460 x 510mm printed circuit board assembly in one pass, capturing its image on-the-fly, in real time, storing the image into memory, and creating inspection data for the entire board. Saki’s bottom-side AOI system ensures PCB quality after dip, selective, and wave soldering. The system completely automates bottom-side inspection, including pin through-hole fillets. It’s fast, cost-effective, and eliminates the need for flipping the PCB.
Saki’s new 3D SPI system has a 12 megapixel camera for the fastest inspection and highest resolution with high accuracy and repeatability. It offers closed-loop functionality and 2D & 3D inspection using an LCoS imaging system. It is compatible with Saki’s 3D AOI hardware and comes with Saki Self-Programming Software.
Previews will also be given of Saki’s new 3D AXI system. The system benefits from the technology advancements of Planar Computer Tomography that perfectly separates top and bottom sides of the PCB and takes continuous 3D images without joints. With a programmable resolution from 13-30µm and best-in-class Cpk and gage repeatability and reproducibility, it delivers 100% head-in-pillow detection. Saki’s AXI has been employed in the semiconductor industry for inspection and measurement of insulated gate bipolar transistors (IGBTs) and land grid arrays (LGAs).
“The past year has seen lots of changes, growth, and new equipment and technologies at Saki,” said Satoshi Otake, general manager of Saki America. “We are excited to share our news and developments with the electronics community. Please make an appointment on our website (www.sakiglobal.com) or stop by our booth to find out more.”
For more information or to make an appointment contact Saki at 1.510.556.6459, email email@example.com, or visit our website at www.sakiglobal.com.
Universal Instruments will commemorate its 100th anniversary at the 2019 IPC APEX EXPO. The company will exhibit on booth 2308, highlighting a flexible solutions portfolio for complex server and automotive assembly. Also on the booth, Universal will feature its new IQ360™ Factory Software Suite – a suite of a la carte smart factory modules designed to control, monitor and improve all aspects of factory operations for maximum productivity.
The Universal Instruments and Metal Company was formed in 1919, manufacturing wire and metal products and producing its first commercial product, “Nu-Hed” safety pins. Eager to grow its business opportunities, the company transformed into a precision machine, tool and die operation, delivering to companies such as IBM®.
In the 1950s and 1960s, the quickly expanding Universal Instruments achieved breakthroughs in the fields of electronic component preparation and sequencing, leading to the development of the industry’s first automated assembly systems for printed circuit board production. Universal again partnered with IBM, providing comprehensive solutions for axial lead component circuit board assembly.
Today, with a lineage of more than 50 years, Universal is the longest-standing company in the electronics assembly space. Universal is also the only US-based electronics assembly solutions provider.
On the booth at APEX, Universal will demonstrate its FuzionOF™ high-speed automation platform, extra-capacity FuzionXC2-37™ Platform, and Uflex™ modular automation platform, which combine to form powerful solutions to challenging server and automotive applications. Also on the booth, the company will unveil its IQ360 Factory Software Suite. Comprised of Design & NPI, Material Management, Production Control, and Monitoring & Analytics modules, IQ360 offers individual capability bundles that can be purchased as needed to meet specific factory requirements, providing a true “connected factory” production environment.
“We’re honored to be celebrating our 100th anniversary here at APEX,” said Universal Instruments Vice President of Marketing, Glenn Farris. “As the pioneers of electronics assembly, it’s rewarding to see how the industry has grown, and how technology innovation from Universal has delivered leading-edge products to meet its ever-changing needs.” Farris continued, “We’re eager to share our server and automotive solutions on the booth and are confident that manufacturers will recognize the differentiation and value we offer. We’ve also strengthened our solutions offering with the introduction of IQ360, and I know our existing and prospective customers will appreciate the comprehensive capabilities and modularity of this product in their quest to build the smart factory of the future.”
To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.
ZESTRON will release the ZESTRON® EYE Mobile at IPC APEX 2019. The ZESTRON® EYE Mobile is the latest addition to ZESTRON’s family of concentration management and measurement solutions.
Offering an ability to monitor the concentration of multiple cleaning processes, this new device works with various cleaning machines, and stores multiple profiles. Using the ZESTRON® EYE mobile as a single tool to monitor multiple cleaning processes ensures optimal resource utilization in a lab or production environment.
User friendly software guides users through the measuring process, providing dosing recommendations for corrections to bath concentration. Incorporating the ZESTRON® EYE Mobile into any cleaning process increases production efficiency and improves traceability by documenting results with built in digital reporting functionality.
Zestron will also have live demonstrations of its technology-backed portfolio of innovative, environmentally-friendly products. Additions to both the VIGON® and HYDRON® product lines have included high performing pH neutral cleaning alternatives for both SMT and semiconductor applications.
To see a live demonstration of the ZESTRON® EYE Mobile and other products visit their booth #3323 at IPC APEX 2019
The Smart Factory is Becoming a Reality
Creating the next generation of digital Industry 4.0 technology standards, APEX 2019 will again take a major step forward by featuring two live production lines, at which visitors can see and experience achievements made in digital standards development over the past year.
The first line will feature both the HERMES standard (IPC-9852) and IPC’s Connected Factory eXchange (CFX) IoT messaging standard (IPC-2591), working seamlessly together to deliver SMT automation value. The second line will feature the wider application of IPC CFX across multiple technologies of assembly production, including manual processes. Both lines feature machines from different vendors, all speaking the same language, creating demonstrable value from machine-to-machine communication, creating a simple to operate, practical, smart and fully connected manufacturing environment. Both standards are currently out for ballot and are expected to be approved and released prior to IPC APEX EXPO.
“Last year at IPC APEX EXPO, we started with a groundbreaking, virtual demo,” said David Bergman, vice president, standards and training, “and this year we will manufacture actual assemblies on the show floor. The CFX/Hermes line will run different board sizes to visibly demonstrate how the two standards complement each other, providing unprecedented automation of production. We are excited to have the collaboration of so many fantastic companies working together to reach Industry 4.0. This is truly an exciting time to be in electronics manufacturing.”
EMS Executive Management Meeting
Covering today’s current marketplace challenges and the strategies to mitigate those challenges, senior-level decision makers from international EMS companies will discuss strategies and initiatives for achieving and sustaining business success at the EMS Executive Management Meeting on January 28.
Attendees will learn the latest on EMS industry trends and issues including: global trade, electronics industry market forecast, technical and legal issues in EMS customer contracts, automation for worker productivity, workforce shortage strategies, supply chain challenges, and more.
Noted industry experts from Lincoln International, IBM, Vishay Intertechnology, Jabil, Arrow Electronics, and more will share how they are addressing industry’s toughest challenges.
“The purpose of the EMS Executive Management meeting is to give executives and senior-level decision makers solutions to some of their most challenging issues,” said Tracy Riggan, senior director, IPC member support. “Presentations focus on business strategies, supply chain issues and industry trends. More importantly, the meeting provides attendees with an exclusive opportunity to network with their peers and discover how other EMS executives are resolving problems.”
Award-winning Entrepreneur in Women’s Leadership, Dr. Cortney Baker, to Keynote Women in Electronics Reception
Dr. Cortney Baker, nationally recognized authority on women in leadership, will speak at the Women in Electronics reception on Wednesday, January 30, 2019, 6:00-7:00 p.m.
Her keynote, “Closing the Gender Gap and Conquering the Mythical Glass Ceiling” will cover the progress women have made in workplace equality despite the continuing gender wage gap, and the underrepresentation of women in executive positions in various industries. Dr. Baker will discuss the challenges women face when advancing their careers, as well as strategies to implement to get beyond these challenges. Participants will gain knowledge of how their organizations can support and promote high potential women into higher level leadership roles.
Host of the talk show “Conquering the Glass Ceiling with Dr. Cortney” and author of “Unlimited: Conquering the Myth of the Glass Ceiling,” Dr. Baker was named the 2016/2017 Texas Business Woman of the Year. A researcher, author, trainer, and TEDxspeaker, Dr. Baker is the founder and CEO of KidsCareHome Health, a multi-million-dollar healthcare organization in Texas and Colorado. She holds an Ed.D in organizational leadership from Pepperdine University.
The Women in Electronics reception, sponsored by Indium Corporation, invites women in the electronics industry to join their colleagues across the supply chain to network, share ideas, and discuss career experiences.
“We are thrilled to welcome Dr. Cortney Baker to IPC APEX EXPO 2019,” said Alicia Balonek, senior director, trade shows and events. “We are eager to learn her insights on expanding women’s leadership roles and to share our experiences navigating a career in a male-dominated industry.”
Executive Forum at IPC APEX EXPO Focuses on Advancing Automotive Electronics
Senior-level executives from across the global electronics industry supply chain will gather to discuss challenges and opportunities of the burgeoning and rapidly changing automotive electronics industry during the IPC Executive Forum on Advancing Automotive Electronics. Presented by IPC’s Hall of Fame Council on January 28, the forum will focus on automotive electronics costs, reliability and programs from concept to production.
The Forum will include speakers from the United States, Asia and Europe to join the discussion on the challenges and opportunities for IPC and the electronics industry. Speakers include representatives from MacDermid-Enthone, Microtek Labs China, Elga Europe, Robert Bosch GmbH Germany, Nexteer Automotive, APTIV, Optimal+ and Ventec International Group.
“As the automotive industry increasingly incorporates electronics into its manufacturing, this provides a unique opportunity for IPC and our members to participate in this continually evolving field,” said Gene Weiner, Executive Forum program chair. “This Forum provides us with a chance to hear from subject matter experts about the many ways for involvement of our industry in automotive electronics.”
Topics will include materials in automotive electronic packaging, PCB reliability testing for automotive electronics, developing film photoresist to meet automotive fine line circuit needs, cost models with suppliers and understanding costs of new technology, developing and getting approval of new material for automotive electronics.
“We are thrilled that the Hall of Fame Council has put together such an important event for our members’ executives,” said Sanjay Huprikar, vice president of Solutions at IPC. “Following our June Automotive Electronics Forum in Nuremberg and the September launch of our new Reliability Council in Frankfurt, this upcoming event in January at IPC APEX EXPO directly supports IPC’s efforts to engage heavily with the transportation vertical.”