StratEdge High-frequency, Thermally-efficient Packages for Compound Semiconductors to be Featured at CS ManTech

San Diego, CA – StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, will display its thermally-efficient packages for compound semiconductor devices, such as gallium nitride (GaN) and gallium arsenide (GaAs), at CS ManTech in booth 305. These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS.

StratEdge uses hardened, or post-fired, ceramic that does not shrink, resulting in complete dimensional stability and precise mechanical tolerances. StratEdge then mates these ceramics with its patented electrical transition designs to manufacture semiconductor packages with exceptionally low electrical losses that operate efficiently, even at frequencies as high as 63+ GHz. StratEdge offers complete automated assembly services for these packages, including gold-tin solder die attach.

“StratEdge was one of the first companies to make packages for compound semiconductors and has regularly attended CS ManTech since its inception,” said Tim Going, president of StratEdge. “Over the years, our patented technology has delivered superior electrical performance for GaN, GaAs, and other compound semiconductor devices while providing mechanical stability for these sensitive devices.”

CS ManTech is being held April 29-May 1 at the Hyatt Regency, Minneapolis, MN. For more information, contact StratEdge at, shop at the StratEdge store on, and/or visit our website at