StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference
San Diego, CA – March 2018 –StratEdge Corporation, a company in design, production, and assembly of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference is being held March 6 and 7th at WekoPa Resort and Casino in Fountain Hills, Arizona.StratEdge packages come in leaded and leadless drop-in formats, leaded and leadless surface mount formats, and specialty high power and high speed digital designs. Some of the packages on display will be:
“5G, and its high-power infrastructure, and IoT and advanced cellular technologies requiring RF and microwave frequencies will make package selection critical,” said Tim Going, StratEdge president. “Packages can no-longer be an after-thought. They not only are necessary for heat dissipation, but also to ensure that the electrical connection is accurate and the device functions as intended, without electrical losses. The IMAPS Device Packaging Conference is a great place to discuss your package requirements.”
For more information, contact StratEdge at email@example.com, shop at the StratEdge store on Amazon.com, sign up for the StratEdge newsletter, and/or visit our new website at www.stratedge.com.